Integrated Interconnects in Data Centres and High-Performance Computing

数据中心和高性能计算中的集成互连

• 批准号: DE150100924
• 负责人: A/Prof Ke Wang
• 金额: $ 25.85万
• 依托单位: RMIT University
• 依托单位国家: 澳大利亚
• 项目类别: Discovery Early Career Researcher Award
• 财政年份: 2015
• 资助国家: 澳大利亚
• 起止时间: 2015-02-25 至 2019-06-30
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/DE150100924
• 关键词: Integrated; Interconnects; Data; Centres; Performance

High-speed interconnects are needed to link, transmit, retrieve, and process intensive data in a time- and energy-efficient and cost-effective manner in data centres and high-performance computing. This project aims to investigate high-speed, integrated interconnects, including novel integrated devices and transceivers on silicon platforms, flexible subsystems and overall system architecture. The research outcomes will be beneficial to a number of industries including integrated chip and circuit design and fabrication, integrated systems, and network infrastructures, and will enable faster platforms for cloud computing, sensing, signal processing, and computational health.

在数据中心和高性能计算中，需要高速互连以高效、节能和经济的方式链接、传输、检索和处理密集型数据。该项目旨在研究高速集成互连，包括硅平台上的新型集成器件和收发器，灵活的子系统和整体系统架构。研究成果将有利于许多行业，包括集成芯片和电路设计与制造、集成系统和网络基础设施，并将为云计算、传感、信号处理和计算健康提供更快的平台。