Charakterisierung der temperaturabhängigen Eigenschaften von partikelgefüllten Polymeren

特别是在微电子领域，由于有源器件性能的不断提高，传热问题显得越来越重要。一个目标是通过开发具有功能性填料的聚合物基基质材料来增强电子元件或周围材料的导热性。此外，材料热性能的变化也会改变生产过程中的工艺参数。例如：较高的导热率可以缩短聚合物生产过程中的注塑成型周期。尽管这些参数的重要性，几乎没有值可以在文献中找到，不能计算。因此，参数是通过试错法获得的。不幸的是，直到今天还没有理论模型可以用来计算复合材料的导热系数。只有通过Agari和Uno的经验模型才能重复计算测量值。然而，模型所使用的2个常数的物理意义还不足以确保热扩散率的理论计算。热扩散率的结果将与注塑成型过程中测得的冷却曲线进行比较，而基于模型的复合材料的冷却行为的描述将被开发。该建议的目标是提供一个基于模型的描述的复合材料的热扩散率以及在注塑成型过程中的冷却行为的热扩散率的影响的贡献。

Especially in micro electronics, evoked by a rising performance of active elements, heat transfer gets more and more important. One goal is to enhance the thermal conductivity of materials in electronic components or around by developing polymer based matrix materials with functional fillers. Additionally the change of thermal properties of materials also changes process parameters in during production. For example: a higher thermal conductivity evokes a shortening of the injection molding cycles in production process of polymers. In spite of the importance of these parameters, nearly no values can be found in literature and can not be calculated. Thus, parameters are obtained by trial and error. Unfortunately until today there are no theoretical models which can be used to calculate thermal conductivity of composites. Only with an empirical model by Agari and Uno measurement values can be calculated reproducibly. Nevertheless, the physical meaning of 2 constants used by the model is not known sufficiently known to ensure a theoretical calculation of thermal diffusivity. Results of thermal diffusivity will be compared with measured cooling curves of the injection molding process, whereas a model based description of the cooling behavior of the composites will be developed. Goal of the proposal is to give a contribution for model based descriptions of the thermal diffusivity of composites as well as the influence of thermal diffusivity on the cooling behavior during injection molding.