Charakterisierung der temperaturabhängigen Eigenschaften von partikelgefüllten Polymeren

特别是在微电子领域，由于活性元件性能的提高，传热变得越来越重要。一个目标是通过开发具有功能填料的聚合物基基质材料来增强电子元件或其周围材料的导热性。此外，材料热性能的变化也会改变生产过程中的工艺参数。例如：在聚合物的生产过程中，较高的热导率会缩短注塑周期。尽管这些参数很重要，但在文献中几乎找不到任何值，也无法计算。因此，参数是通过试错法获得的。不幸的是，直到今天还没有理论模型可以用来计算复合材料的导热系数。只有用Agari和Uno的经验模型才能计算出可重复性的测量值。然而，模型所使用的两个常数的物理意义还不够清楚，无法保证热扩散率的理论计算。热扩散系数的结果将与注射成型过程的实测冷却曲线进行比较，而基于模型的复合材料冷却行为描述将被开发出来。本文的目的是为基于模型的复合材料热扩散率的描述以及热扩散率对注射成型冷却行为的影响做出贡献。

Especially in micro electronics, evoked by a rising performance of active elements, heat transfer gets more and more important. One goal is to enhance the thermal conductivity of materials in electronic components or around by developing polymer based matrix materials with functional fillers. Additionally the change of thermal properties of materials also changes process parameters in during production. For example: a higher thermal conductivity evokes a shortening of the injection molding cycles in production process of polymers. In spite of the importance of these parameters, nearly no values can be found in literature and can not be calculated. Thus, parameters are obtained by trial and error. Unfortunately until today there are no theoretical models which can be used to calculate thermal conductivity of composites. Only with an empirical model by Agari and Uno measurement values can be calculated reproducibly. Nevertheless, the physical meaning of 2 constants used by the model is not known sufficiently known to ensure a theoretical calculation of thermal diffusivity. Results of thermal diffusivity will be compared with measured cooling curves of the injection molding process, whereas a model based description of the cooling behavior of the composites will be developed. Goal of the proposal is to give a contribution for model based descriptions of the thermal diffusivity of composites as well as the influence of thermal diffusivity on the cooling behavior during injection molding.