QuILT - Quantum element Interposition by Laser Transfer

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Telecommunications has become one of the most vital part of human life globally and continues to expand and increase its impact on our lives and as a result on commercialisation and industrial progress. Information security is continuously at risk as the communication channels and data volumes continue to increase. Data encryption methods and algorithms are advancing but lag behind the evolution of intercepting systems and codes. Moreover, with the advancement of quantum computing we are at anticipation of the quantum apocalypse, where encryption by conventional computing means will be inadequate. Quantum encryption of transmitted data, at low cost and integrated in simple, low power consumption and small size devices that match personal electronics specifications will become of paramount importance before the point where quantum computing becomes available to everyone. The QuILT project aims at addressing this need by introducing a manufacturing step to simplify the implementation of quantum emitters in Quantum Key Distributor (QKDs) and other quantum entangled photon emission devices.The current state of the art in devices that utilise quantum entanglement requires superconductors and cryogenic systems while in the case of photonic based entanglement, complex device creation with multiple active and passive layers suffers from low probability of entangled photon emission. QuILT will allow for photonic entanglement capability to be applied directly on photonic or opto-electronic devices without risking or changing the current processes being followed by the manufacturer. The approach, using the well-established LIFT (Laser Induced Forward Transfer) process to deposit quantum dots on simple or complex photonic integrated or semiconductor devices and enable devices for quantum entanglement based operation. The process can also be applied on chalcogenide quantum dots which have been proven to increase efficiency in entangled photon generation. The process feasibility will be tested on low cost wet etched silica on silicon wafer device and entangled photon emission will be captured by advanced sensors and analysed with probabilistic algorithms.The QuILT technology solution aims at the heart of the technical issues that complicate the construction of quantum devices and make them very expensive for mass use and introduction to the wider industrial or even consumer market. Devices can thus be constructed in the miniature chip size that we are used to from the semiconductor and micro-electronics industry, and also observe the cost models of microelectronics, hence allowing their integration into commercial appliances.