Validation of novel method of tin oxide characterisation in electronic components as part of supply chain quality assurance - R6 Cont

Adaptix为医疗应用开发新型3D x射线成像技术。一个原型也在无损检测（NDT）应用中进行了测试，用于检查电子设备和组件，远远超过了当前2D x射线无损检测系统的成像能力。它也有更小的占地面积，成本更低，产生更少的通量（需要更少的屏蔽，以确保安全，所以便携式桌面使用）。目的是提供一种新颖的，商业上有吸引力的质量保证程序，它不涉及人工处理每个样品，并且可以快速适用于整批样品。该项目为为现有产品添加新的/互补的多模态功能奠定了基础，在屏蔽x射线柜内检测电子芯片引脚（“缺陷引脚”）以及“一次扫描”中的物理异常。氧化锡对不同波长的光有不同的吸收，这是我们要开发的特性。通过光学扫描，我们想检测电子连接器上的氧化锡。当组件没有在适当的环境中维护时，就会形成氧化物。氧化锡还可以表明是否将假冒/翻新的零件混入了所谓的新产品中，这在全球和不受监管的供应链中经常出现，其中零件被多次买卖。在每年8000亿美元的半导体销售额中，约有320亿美元是通过“渠道”销售的。美国海军估计其15%的电子部件是假冒的，这可能是一个比大多数供应链更好的控制环境。该行业需要一种低成本的方法来增加测试吞吐量，而不需要使用昂贵且缺乏训练有素的电子检查员。这为NDT应用的3D x射线系统增加了显著的价值。它将为该系统的第二版提供一个高度新颖和市场领先的功能（在一个新的市场），以推动进一步的收入和行业效益。作为NPL的延续，我们完成了我们主要的第一个目标，即哪种方法最适合检测氧化。NPL还证明并确定了氧化锡位于电子元件连接器上的位置。不幸的是，由于时间跨度太短，我们无法完成第二个主要任务，即研究这种方法在商业环境中工作的阈值/参数是什么，在商业环境中，功能良好的“好”部件可能会失败，或者我们的坏部件可能会通过。为了将其转化为可行的商业产品以增加Adaptix的收入和行业收益，完成该项目至关重要。

Adaptix develops novel 3D X-ray imaging technology for medical applications. A prototype has also been tested in Non-Destructive Testing (NDT) applications to inspect electronics devices and components and far exceeded the imaging capability of current 2D X-ray NDT systems. It also has a smaller footprint, is lower cost and produces less flux (requires less shielding to be safe, so portable for desktop use). The aim is to deliver a novel, commercially attractive quality assurance procedure, which doesn't involve manual handling of each sample and is applicable quickly to an entire batch of samples.This project lays the groundwork to add a new/complementary multi-modal capability to the existing product, within the shielded X-ray cabinet to detect electronic chip pins ('defect pins') as well as physical abnormalities in 'one scan'.Tin oxide has differential absorption of different optical wavelengths, a characteristic we aim to exploit. With an optical scan we want to detect tin oxide on electronic connectors. Oxides form when components aren't maintained in an appropriate environment. Tin oxide may also indicate if counterfeit/refurbished parts have been mixed into supposedly new products, which is often the case in global and unregulated supply chains where parts are bought and sold many times. Of the annual $800bn in semiconductors sales,~ $32bn go through 'channel'. The US Navy estimates 15% of its electronic parts are counterfeit, and this is probably a better controlled environment than the majority of supply chains.The industry requires a low-cost method of increasing test throughput without the use of expensive and scarce trained electronics inspectors. This adds significant value to our 3D X-ray system for NDT applications. It would offer a highly novel and market-leading feature (in a new market) for the second version of the system to drive further revenues and industry-benefit.As a continuation with NPL, we accomplished our main first goal of which method is the best for detecting oxidation. NPL also proved and identified where the tin oxide is located on an electronic component connector. Unfortunately because of the short time span we couldn't complete the second main task to research what the threshold/parameters are for this method to work in a commercial environment where 'good' parts that function acceptably well could fail, or we bad ones could pass. It is essential to complete the project in order to turn this into a viable commercial product for increased Adaptix revenue and industry gains.