Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems

PUNCH通过开发一种新的光交换范例，为时间确定性和时间敏感网络提供了解决方案，该范例(I)通过提供全对全可重构互连，打破了灵活性（超动态可重构性）和确定性（保证延迟和抖动）之间的权衡；（II）通过激活带宽控制来减少拥塞，以便在网络中的热节点之间分配额外的容量；（III）提供了无与伦比的动态和带宽效率，进一步实现了时域内的多路复用，具有快速可重构能力。2×2×8Lambda波长选择开关元件将被缩放为完全无阻塞的8x8x8Lambda和16x16x8Lambda可重构光开关结构。微转移打印兼容半导体光放大器的III-V代工工艺的发展使硅光子平台上的无损光开关成为可能。用于驱动、控制和监控开关结构的定制配置电子集成电路将与光子集成电路紧密集成到异质扇出晶圆级封装中，在200mm重构晶圆平台上进行加工。此外，光子集成电路的光接口将使用光再分配层来完成，在高密度有机基板上提供光扇出，并允许可扩展的光纤封装解决方案。新的集成和封装工艺将应用于制造1.6 Tbit/s光收发器，提供光交换机与电子资源（计算，内存和存储）之间的接口。光交换机和收发器原型将在5G RAN传输网络中进行演示，用于TSN前传应用和数据中心的内存分解。

PUNCH offers a solution for time-deterministic and time-sensitive networks by developing a new optical switching paradigm which (I) breaks the trade-off between flexibility (ultra-dynamic reconfigurability) and determinism (guaranteed latency and jitter) by offering an all-to-all reconfigurable interconnect; (II) reduces congestion by activating bandwidth steering so that additional capacity can be allocated between hot nodes in the network; (III) provides unparalleled dynamics and bandwidth efficiency by further enabling multiplexing in the time domain with fast reconfigurable capability. A 2×2×8Lambda wavelength selective switching element will be scaled to a fully non-blocking 8x8x8Lambda and 16x16x8Lambda reconfigurable optical switch fabric. The development of a III-V foundry process for micro-transfer-printing-compatible semiconductor optical amplifiers enables loss-less optical switching on a silicon photonics platform. Custom configuration electronic ICs to actuate, control, and power-monitor a scaled switch fabric will be densely integrated with the photonic ICs into a heterogeneous fanout wafer-level package, processed on a 200mm reconstructed wafer platform. In addition, the optical interfacing to the photonic ICs will be accomplished using an optical redistribution layer, providing an optical fanout on high density organic substrates, and allowing for a scalable optical fiber packaging solution. The novel integration and packaging processes will be applied for manufacturing 1.6 Tbit/s optical transceivers providing the interface between optical switches and electronic resources (compute, memory, and storage). The optical switch and transceiver prototypes will be demonstrated in a 5G RAN Transport Network, for TSN Fronthaul applications and for memory disaggregation in data centers.