FlexIC - Printed Logic Supply Chain

FlexIC - 印刷逻辑供应链

• 批准号: 100835
• 金额: $ 112.14万
• 依托单位: PRAGMATIC SEMICONDUCTOR LIMITED
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2010
• 资助国家: 英国
• 起止时间: 2010 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=100835
• 关键词: FlexIC; Printed; Logic; Supply; Chain

The transistor is the basic building block for logic and has been key to the success of microelectronics from highly demanding aerospace applications to commoditised consumer electronics. Printed logic, analogous to the silicon integrated chip, is necessary for plastic electronics to realise its forecast huge potential. Today logic accounts for just £7M (0.5%) of the plastic electronics market and yet by 2028 is expected to achieve a similar share as today’s silicon logic (~33%, £65B, IDTechEx). Conventional transistor design and low-performance materials severely limit development of printed logic beyond simple arrays of identical transistors currently achievable. The objectives for this project are (i) to establish a manufacturing supply-chain for printed NMOS logic from fabrication of printed logic (nanoscale transistor and logi-gates) – Epigem/PragmatIC/Cambridge Integrated Knowledge Centre; materials (metal oxide semiconductor and complementary dielectrics) and deposition equipment – Cambridge University/PlasmaQuest; high-resolution multi-level printed circuitry – Epigem; singulation and packaging - Optek; functional test - Keithley; device modelling - Silvaco; (ii) proof-of-principle for printed PMOS logic for future integration in CMOS (low-power plastic electronics) - PPL/CIKC/CU/PQL. The project will employ a sheet-based process to provide printed logic component which itself will be commercially viable. However, each process developed will have a natural transition for future continuous processing to drive lower-cost production. Feasibility trials for continuous processing will be undertaken where possible within project constraints.

晶体管是逻辑的基本构建模块，是微电子技术成功的关键，从高要求的航空航天应用到商品化的消费电子产品。印刷逻辑，类似于硅集成芯片，是塑料电子实现其预测的巨大潜力所必需的。今天，逻辑仅占塑料电子市场的700万英镑（0.5%），但到2028年，预计将实现与今天的硅逻辑（约33%，650亿英镑，IDTechEx）相似的份额。传统的晶体管设计和低性能材料严重限制了目前可实现的相同晶体管的简单阵列之外的印刷逻辑的发展。本项目的目标是：（i）建立一个印刷NMOS逻辑的制造供应链，（纳米晶体管和逻辑门）- Epigem/PragmatIC/剑桥综合知识中心;材料（金属氧化物半导体和互补半导体）和沉积设备-剑桥大学/PlasmaQuest;高分辨率多层印刷电路- Epigem;单切和封装- Optek;功能测试- Keithley;器件建模- Silvaco;（ii）印刷PMOS逻辑的原理验证，用于未来CMOS集成（低功率塑料电子器件）- PPL/CIKC/CU/PQL。该项目将采用一种基于片材的工艺来提供印刷逻辑元件，其本身将是商业上可行的。然而，开发的每一种工艺都将有一个自然的过渡，以便未来的连续加工来推动低成本生产。将在项目限制范围内尽可能进行连续加工的可行性试验。