FlexIC - Printed Logic Supply Chain
FlexIC - Printed Logic Supply Chain
批准号:
100835
负责人:
金额:
$112.14万
依托单位国家:
英国
项目类别:
Collaborative R&D
财政年份:
2010
资助国家:
英国
项目状态:
已结题
起止时间:
2010 至 --
中文摘要
晶体管是逻辑的基本组成部分,从高要求的航空航天应用到商品化的消费电子产品,它一直是微电子成功的关键。印刷逻辑,类似于硅集成芯片,是必要的塑料电子实现其预测的巨大潜力。今天,逻辑仅占塑料电子市场的700万英镑(0.5%),但到2028年,预计将达到与今天的硅逻辑相似的份额(约33%,650亿英镑,IDTechEx)。传统的晶体管设计和低性能材料严重限制了印刷逻辑的发展,而不是目前可以实现的简单的相同晶体管阵列。该项目的目标是:(i)从印刷逻辑(纳米级晶体管和逻辑门)的制造中建立印刷NMOS逻辑的制造供应链- Epigem/PragmatIC/剑桥综合知识中心;材料(金属氧化物半导体和互补电介质)和沉积设备-剑桥大学/PlasmaQuest;高分辨率多级印刷电路。Epigem;模拟和包装。Optek;功能试验-基斯利;设备建模- Silvaco;(ii)印刷PMOS逻辑的原理验证,用于未来集成在CMOS(低功耗塑料电子)- PPL/CIKC/CU/PQL中。该项目将采用基于薄片的工艺来提供印刷逻辑组件,该组件本身将具有商业可行性。然而,开发的每一种工艺都将有一个自然的过渡,以实现未来的连续加工,以推动低成本生产。在项目限制的情况下,将尽可能进行连续加工的可行性试验。
英文摘要
The transistor is the basic building block for logic and has been key to the success of microelectronics from highly demanding aerospace applications to commoditised consumer electronics. Printed logic, analogous to the silicon integrated chip, is necessary for plastic electronics to realise its forecast huge potential. Today logic accounts for just £7M (0.5%) of the plastic electronics market and yet by 2028 is expected to achieve a similar share as today’s silicon logic (~33%, £65B, IDTechEx). Conventional transistor design and low-performance materials severely limit development of printed logic beyond simple arrays of identical transistors currently achievable. The objectives for this project are (i) to establish a manufacturing supply-chain for printed NMOS logic from fabrication of printed logic (nanoscale transistor and logi-gates) – Epigem/PragmatIC/Cambridge Integrated Knowledge Centre; materials (metal oxide semiconductor and complementary dielectrics) and deposition equipment – Cambridge University/PlasmaQuest; high-resolution multi-level printed circuitry – Epigem; singulation and packaging - Optek; functional test - Keithley; device modelling - Silvaco; (ii) proof-of-principle for printed PMOS logic for future integration in CMOS (low-power plastic electronics) - PPL/CIKC/CU/PQL. The project will employ a sheet-based process to provide printed logic component which itself will be commercially viable. However, each process developed will have a natural transition for future continuous processing to drive lower-cost production. Feasibility trials for continuous processing will be undertaken where possible within project constraints.
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