GRASP - GREEN AGILE SEMICONDUCTOR PRODUCTION

柔性电子技术是近几十年来发展最快的技术之一。传统的路径是集成在集成智能系统中称为“混合集成”或“柔性混合电子”的柔性基板上的电子元件，如硅芯片（例如微控制器）。我们认为这种方法对于未来的大批量、低成本和一致性集成智能系统来说不是一个可行的长期解决方案。我们的愿景是一个集成的智能系统，仅由柔性电子元件构建，包括模拟电路，数字逻辑和存储器。我们将这种系统称为“本地灵活集成智能系统”或NFISS。nfisse将使快速消费品和医疗可穿戴设备领域的新产品成为可能，因为传统的硅芯片太昂贵、太笨重、不兼容。该项目将开发一个灵活的微控制器单元（FlexMCU），这是实现nfisse所缺少的关键组件。FlexMCU必须是集成多种功能的低功耗芯片，以满足快速消费品和医疗可穿戴设备应用的功能需求。将开发一种新型混合互补低功耗薄膜晶体管技术（每个晶体管功耗降低100倍），以在可持续的柔性芯片工厂中制造FlexMCU，减少100-1000倍的环境足迹。FlexMCU设计是为特定领域量身定制的，由一个基于开源RISC-V的处理器组成，具有内置的安全功能，模拟前端，片上存储器和其他外围设备。然后，FlexMCU将使用新颖的组装和粘合方法组装到柔性薄膜上，然后将柔性薄膜与其他柔性电子元件集成到柔性基板上，以构建第一个概念验证NFISS，该NFISS将在两个医疗可穿戴应用中进行验证。

Flexible Electronics has been one of the fastest developing technologies in recent decades. The traditional path is electronic components such as silicon chips (e.g., microcontrollers) integrated onto flexible substrates called “hybrid integration” or “flexible hybrid electronics” in integrated smart systems. We believe that this approach is not a viable long-term solution for future high-volume, low-cost and conformable integrated smart systems. Our vision is an integrated smart system that is built with only flexible electronic components including analogue circuitry, digital logic and memories. We call such a system a “Natively Flexible Integrated Smart System” or NFISS. NFISSes will enable new products in the Fast Moving Consumer Goods and healthcare wearables that have not been possible before because conventional silicon chips are too costly, too bulky and not conformable. The project will develop a flexible microcontroller unit (FlexMCU), which is the key component missing to enable NFISSes. The FlexMCU must be a low-power chip integrating a variety of functionality to address the functional requirements of the applications in FMCG and healthcare wearables. A novel hybrid complementary low-power thin-film transistor technology (100x per-transistor power reduction) will be developed to fabricate the FlexMCU in a sustainable flexible chip fab with 100-1000x less environmental footprint. The FlexMCU design is tailored to a specific domain composed of an open-source RISC-V based processor with built-in security features, an analogue frontend, on-chip memory and other peripherals. Then, the FlexMCU will be assembled using novel assembly and bonding methods onto a flexible film, which is, in turn, integrated onto a flexible substrate along with other flexible electronic components to build the first proof-of-concept NFISS thatwill be validated on two healthcare wearable applications.