GRASP - GREEN AGILE SEMICONDUCTOR PRODUCTION

GRASP - 绿色敏捷半导体生产

• 批准号: 10099437
• 金额: $ 120.33万
• 依托单位: PRAGMATIC SEMICONDUCTOR LIMITED
• 依托单位国家: 英国
• 项目类别: EU-Funded
• 财政年份: 2024
• 资助国家: 英国
• 起止时间: 2024 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10099437
• 关键词: GRASP; GREEN; AGILE; SEMICONDUCTOR; PRODUCTION

Flexible Electronics has been one of the fastest developing technologies in recent decades. The traditional path is electronic components such as silicon chips (e.g., microcontrollers) integrated onto flexible substrates called “hybrid integration” or “flexible hybrid electronics” in integrated smart systems. We believe that this approach is not a viable long-term solution for future high-volume, low-cost and conformable integrated smart systems. Our vision is an integrated smart system that is built with only flexible electronic components including analogue circuitry, digital logic and memories. We call such a system a “Natively Flexible Integrated Smart System” or NFISS. NFISSes will enable new products in the Fast Moving Consumer Goods and healthcare wearables that have not been possible before because conventional silicon chips are too costly, too bulky and not conformable. The project will develop a flexible microcontroller unit (FlexMCU), which is the key component missing to enable NFISSes. The FlexMCU must be a low-power chip integrating a variety of functionality to address the functional requirements of the applications in FMCG and healthcare wearables. A novel hybrid complementary low-power thin-film transistor technology (100x per-transistor power reduction) will be developed to fabricate the FlexMCU in a sustainable flexible chip fab with 100-1000x less environmental footprint. The FlexMCU design is tailored to a specific domain composed of an open-source RISC-V based processor with built-in security features, an analogue frontend, on-chip memory and other peripherals. Then, the FlexMCU will be assembled using novel assembly and bonding methods onto a flexible film, which is, in turn, integrated onto a flexible substrate along with other flexible electronic components to build the first proof-of-concept NFISS thatwill be validated on two healthcare wearable applications.

柔性电子技术是近几十年来发展最快的技术之一。传统的途径是电子元件，如硅芯片（例如，微控制器）集成到柔性衬底上，在集成智能系统中称为“混合集成”或“柔性混合电子器件”。我们认为，这种方法不是未来大批量，低成本和舒适的集成智能系统的可行的长期解决方案。我们的愿景是一个集成的智能系统，该系统仅使用灵活的电子元件，包括模拟电路，数字逻辑和存储器。我们称这样的系统为“本地灵活集成智能系统”或NFISS。NFISSes将使快速消费品和医疗可穿戴设备中的新产品成为可能，这在以前是不可能的，因为传统的硅芯片太昂贵，太笨重，而且不兼容。该项目将开发一个灵活的微控制器单元（FlexMCU），这是实现NFISS所缺少的关键组件。FlexMCU必须是一款集成了各种功能的低功耗芯片，以满足快速消费品和医疗可穿戴设备应用的功能要求。将开发一种新型的混合互补低功耗薄膜晶体管技术（每个晶体管功耗降低100倍），以在可持续的柔性芯片工厂中制造FlexMCU，环境足迹减少100- 1000倍。FlexMCU的设计是针对特定领域定制的，包括一个基于开源RISC-V的处理器，具有内置的安全功能，模拟前端，片上存储器和其他外设。然后，FlexMCU将使用新颖的组装和粘合方法组装到柔性薄膜上，然后将其与其他柔性电子元件沿着集成到柔性基板上，以构建第一个概念验证NFISS，该NFISS将在两个医疗保健可穿戴应用中进行验证。