ELCOSINT – Electronic Component Sintered Interconnections

ELCOSINT — 电子元件烧结互连

• 批准号: 101228
• 金额: $ 59.83万
• 依托单位: MICROCHIP TECHNOLOGY CALDICOT LIMITED
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2012
• 资助国家: 英国
• 起止时间: 2012 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=101228
• 关键词: ELCOSINT; Electronic; Component; Sintered; Interconnections

The ELCOSINT project will develop novel polymeric, sintered interconnection materials for electronic assemblies specifically designed to replace high-Pb content materials and further increase the operating temperature of electronic assemblies. The UK has a significant high value manufacturing base in demanding harsh environment applications such as aerospace, down hole drilling, automotive and power management. The multi-disciplinary project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatable with standard microelectronics manufacturing process enabling fast take up. A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterisation, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.

ELCOSINT项目将开发用于电子组件的新型聚合物烧结互连材料，专门用于取代高铅含量材料，并进一步提高电子组件的工作温度。英国在航空航天、井下钻井、汽车和电力管理等苛刻环境应用领域拥有重要的高价值制造基地。该跨专业项目团队将开发用于电子元件互连的材料和制造工艺，使用纳米银基材料在元件和基板之间形成接头。该技术将与标准微电子制造工艺兼容，从而实现快速采用。将设计和生产一个高温传感器放大器演示器，以便对开发进行表征、评估和鉴定，从而能够快速生产可靠、鲁棒的电子系统。