Variable Topology Semi-Rigid Packaging (V-Top)

可变拓扑半刚性封装（V-Top）

• 批准号: 70192
• 金额: $ 5.73万
• 依托单位: MACHINERY AUTOMATION LTD
• 依托单位国家: 英国
• 项目类别: Feasibility Studies
• 财政年份: 2020
• 资助国家: 英国
• 起止时间: 2020 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=70192
• 关键词: Variable; Topology; Semi; Rigid; Packaging

Variable Topology Semi-Rigid Packaging is a new and innovative packaging system using multi-material 3D printing technology that may be used in a production environment to create customisable packaging, on demand. The application of surface tessellation to shrinkable films using fused deposition modelling (3D Printing) will result in the film topology automatically changing during shrinkage to create food or drink packaging.The benefits of such a process include a significant reduction in costs and resources employed in the manufacture, delivery and storage of pre-formed packaging products plus substantially reduced wastage associated with the packaging of seasonal or short shelf-life products (i.e. elimination of 'out-of-date packaging).The concept is founded on water sensitive composites developed at MIT. The technology has been termed 4D printing as it incorporates the element of time. MIT's moisture sensitive material can be 'programmed' to fold and unfold in the presence of humidity. MIT have created 'multi-material prints with the capability to transform from one shape to another'. This technology uses heat sensitive materials rather than moisture sensitive materials.The objective of the project is to establish that this innovation is technically and commercially viable and that it will address the issues associated with current packaging and processing systems.

可变拓扑半刚性包装是一种使用多材料3D打印技术的新型创新包装系统，可以在生产环境中根据需要创建可定制的包装。将表面镶嵌应用到使用熔融沉积造型(3D打印)的收缩薄膜中，将导致薄膜在收缩过程中自动改变拓扑结构，以创建食品或饮料包装。这种工艺的好处包括显著降低了预成型包装产品的制造、交付和存储所使用的成本和资源，以及与季节性或短期保质期产品的包装相关的显著减少的损耗(即消除了过时的包装)。这一概念基于麻省理工学院开发的水敏复合材料。这项技术被称为4D打印，因为它融入了时间的元素。麻省理工学院的湿气敏感材料可以通过编程在有湿度的情况下折叠和展开。麻省理工学院已经创造了“多材料印花，能够从一种形状转变成另一种形状”。这项技术使用的是热敏材料，而不是湿敏材料。该项目的目标是确定这项创新在技术和商业上都是可行的，并将解决与当前包装和加工系统相关的问题。