Low-cost massively-parallel assembly process for MEMS components

MEMS 元件的低成本大规模并行组装工艺

• 批准号: 710563
• 金额: $ 9.04万
• 依托单位: NU NANO LTD
• 依托单位国家: 英国
• 项目类别: GRD Proof of Concept
• 财政年份: 2014
• 资助国家: 英国
• 起止时间: 2014 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=710563
• 关键词: Low; cost; massively; parallel; assembly

Accelerometers, gyroscopes and microphones are just some of the everyday applications ofmicroelectromechanical systems (MEMS) that are now ubiquitous components in consumerelectronic devices. As manufacturers of smart phones and tablets endeavour to shrink theirdevices ever further, so the wasted space between components in these devices becomes evermore inhibiting, both in terms of physical size and cost. Separating the manufacturingprocesses of the MEMS component and the host chip can enable massive space and costsavings to be realised, but only if the process designed to subsequently combine the two islow-cost and high-throughput. Nu Nano is developing a process of this nature which iscapable of addressing 400 MEMS components simultaneously and targeting a 90% reductionin manufacturing costs.Nu Nano will demonstrate this by manufacturing probes for atomic force microscopy (AFM).These probes, made from silicon, consist of a cantilever and tip, much akin to a record playercantilever and stylus, but the rest of the silicon area is only used for handling. By separatingthe fabrication of the complex functional part of the probe and the bulk chip material, thismassive cost saving will be realised

加速计、陀螺仪和麦克风只是微电子机械系统(MEMS)的一些日常应用，而MEMS现在是消费电子设备中无处不在的部件。随着智能手机和平板电脑制造商努力进一步缩小其设备的尺寸，这些设备中组件之间浪费的空间在物理尺寸和成本方面都变得越来越令人抑制。分离MEMS组件和主机芯片的制造工艺可以实现大量的空间和成本节约，但前提是随后设计的将两者结合在一起的工艺是低成本和高产量的。Nu Nano正在开发一种这种性质的工艺，能够同时处理400个MEMS组件，目标是将制造成本降低90%。Nu Nano将通过制造原子力显微镜(AFM)探针来证明这一点。这些探针由硅制成，由悬臂和尖端组成，非常类似于创纪录的播放器、悬臂和触笔，但硅区的其余部分仅用于处理。通过将探头复杂功能部分的制造与块状芯片材料分离，将实现这一巨大的成本节约