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INSULATION OF IMPLANT DEVICES BY PLASMA POLYMER COATINGS

通过等离子体聚合物涂层对植入装置进行绝缘

基本信息

批准号：
3501646
负责人：
MICHAEL NICHOLS
金额：
$ 4.57万
依托单位：
NICHOLS TECHNOLOGIES, INC.
依托单位国家：
美国
项目类别：
财政年份：
1989
资助国家：
美国
起止时间：
1989-09-01 至 1990-02-28
项目状态：
已结题

来源：
https://reporter.nih.gov/project-details/3501646
关键词：
biomaterial compatibility biomaterial development /preparation plasma polymers

项目摘要

The long term objective of this proposed research is to provide a commercial facility and reactors for the production of thin polymer hermetic insulating materials specifically developed of the physiological environment and for the prevention of electrolytic corrosion of integrated circuit metallizations and lead wires. The methods of polymer formation by plasma polymerization and vacuum bake technology will be utilized to prepare surfaces, provide intermediate layers of composite film encapsulation, and reduce the number of encapsulant processing steps currently in use. Specifically, this research will determine if plasma reactor conditions optimized for adhesion can be combined will vacuum bake technology to reduce the moisture content and improve the encapsulation of MOS integrated circuit devices. In addition, the correlation of plasma polymerization energy parameters and corrosion protection of circuit metallizations and bond wires will be investigated. Commercially, there exists a large potential market for totally implanted intelligent devices which are scaled to the dimensions of the anatomical analogues that they are to assist or replace. Size constraints prohibits the application of conventional encapsulation techniques by hermetic sealing in metal packages. A significant technological innovation in packaging technology can be achieved by the introduction of hermetic sealing by plasma polymer encapsulation.

这项拟议研究的长期目标是提供一个用于生产稀薄聚合物的商业设施和反应堆专门开发的密封绝缘材料生理环境与电解液的预防集成电路金属化和引线的腐蚀。等离子体聚合和真空聚合形成聚合物的方法将利用烘焙技术来准备表面，提供中间层复合薄膜的封装，降低了当前正在使用的密封剂处理步骤数。具体地说，这项研究将确定等离子体反应堆的条件经过优化的粘合可结合将真空烘焙技术降低水分含量，提高MOS的包封性集成电路器件。此外，血浆的相关性聚合能参数与电路防腐将对金属化和粘结线进行研究。在商业上，完全有很大的潜在市场。植入的智能设备，其尺寸可扩展到他们要帮助或取代的解剖学类似物。大小约束禁止应用常规封装金属包装中的密封技术。一个重要的包装技术的技术创新可以通过介绍了等离子体聚合物封装的密封技术。