Lancaster EPP Capital bid 2018

兰卡斯特 EPP 资本投标 2018

• 批准号: ST/S002235/1
• 负责人: Roger Jones
• 金额: $ 6.53万
• 依托单位: Lancaster University
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2018
• 资助国家: 英国
• 起止时间: 2018 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=ST%2FS002235%2F1
• 关键词: Lancaster; EPP; Capital; bid; 2018

This grant will allow Lancaster to build a new facility that will allow state of the art semiconductor devices to the electronics required to control and read them out. it will also help develop new infrared detectors., The 'flip chip' bonding technique will allow the devices to be tested in a more efficient way, with fewer poor bonds and damaged devices, and yet will allow binding in a shorter time.It will also provide for the UK for the first time a two photon absorption method to measure the radiation damage in semiconductor devices. Only very few places in the world have such a facility, and it will provide a very precise method to test the devices at specific points and at well defined depths into the volume. The precision will allow place the UK at the forefront of sensor development.Finally, the grant will allow new integrated techniques to provide high capacity computer storage and processing to be adapted to support the very large volumes of data coming from particle physics and astronomy projects in a flexible and stable way. These developments will also inform 'real world' applcations.

这笔赠款将允许兰开斯特建立一个新的设施，将允许最先进的半导体设备的电子控制和读取它们。它还将有助于开发新的红外探测器，倒装芯片焊接技术将使器件的测试更加有效，焊接不良和损坏的器件更少，而且焊接时间更短。它还将首次为英国提供一种双光子吸收方法来测量半导体器件的辐射损伤。世界上只有极少数地方有这样的设施，它将提供一种非常精确的方法，在特定的点和明确定义的深度进入体积测试设备。最后，该赠款将允许新的集成技术提供高容量的计算机存储和处理，以支持来自粒子物理和天文学项目的大量数据，并以灵活和稳定的方式进行调整。这些发展也将告知“真实的世界”的应用。