Lancaster EPP Capital bid 2018

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This grant will allow Lancaster to build a new facility that will allow state of the art semiconductor devices to the electronics required to control and read them out. it will also help develop new infrared detectors., The 'flip chip' bonding technique will allow the devices to be tested in a more efficient way, with fewer poor bonds and damaged devices, and yet will allow binding in a shorter time.It will also provide for the UK for the first time a two photon absorption method to measure the radiation damage in semiconductor devices. Only very few places in the world have such a facility, and it will provide a very precise method to test the devices at specific points and at well defined depths into the volume. The precision will allow place the UK at the forefront of sensor development.Finally, the grant will allow new integrated techniques to provide high capacity computer storage and processing to be adapted to support the very large volumes of data coming from particle physics and astronomy projects in a flexible and stable way. These developments will also inform 'real world' applcations.