Advanced methodologies and tools for signal integrity analysis of high-speed electronic systems

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During the recent years, the intense drive for high-frequency and miniature designs has been at the forefront of new developments in simulation and verification methodologies focused on microelectronics, electromagnetic (EM) and computing systems. With the significant advances in large-scale integration technology, at both the electronic chip and package level, the operating frequencies are rapidly rising in the GHzs range and communication switches are being designed to transmit data that have bit rates faster than giga-bits per second. With such increasing demands for high signal speeds coupled with the decreasing feature sizes, signal integrity effects such as delay, distortion and crosstalk become the dominant factors limiting the overall performance of high-speed systems. In addition to the above, the trend towards low power consumption and increased integration of analog circuits with digital blocks has further complicated the design and analysis process. However, the currently available modeling and analysis tools/methodologies do not adequately handle the above emerging challenges associated with high-speed designs. To cope with these new requirements of managing the complexity of high-speed modules, the applicant plans to undertake new research initiatives. Specifically, the focused modules of these initiatives are as follows: (a) Signal integrity analysis tools and verification methodologies for high-speed electronic systems. (b) Mixed-domain methodologies for analysis of high-speed circuits, EM, optical and MEMS systems. The impact of the proposed research would be to facilitate the development of new generation algorithms and tools for fast/accurate analysis/validation of high-speed modules, leading to the reduction of design cycle time and the product cost. The proposed initiatives are intended to target high-speed applications in wide range of design levels, including on-chip ICs, multi-chip modules, packages, printed circuit boards and backplanes.