Managing the Complexity of Multi-Physics based High-Speed Electronic Designs

全球电子行业的快速发展使通信和计算产品成为日常生活的一部分，并高度普及。用户对更高的带宽和更先进的通信以及更好的信息管理的巨大需求需要新一代的多功能电子电路和系统，它们以更低的功率和更尖锐的激励运行。*然而，由于如此高的数据速率和对纳米级设计的渴望，高频和高密度相关问题正迅速成为限制电子设计性能的主要因素。因此，必须注意到，电路、电磁学、热学和机械等不同设计学科之间的传统/人工边界正在迅速消失，混合域设计挑战正在出现。尽管设计者面临着对涉及不同和不同设计模块的基于多物理的共同设计和共同分析的日益增长的需求的挑战，但目前可用的设计框架和方法并不足以支持他们。为了解决上述困难，提出了以下研究举措，以开发以高速电子电路和系统为重点的新框架和设计方法：*(A)开发高效和准确的基于多物理的框架，用于模拟、数字、射频(RF)、电磁(EM)和微电子机械(MEMS)模块的混合域分析。*(B)开发信号、电源和电磁干扰(EMI)共同设计和共同分析方法和工具，重点是高级互连模型，电力分配网络和基于列表数据的子网络。*(C)开发新的电路模拟和优化方法，重点是利用新兴的多核计算平台。*拟议的研究倡议侧重于战略问题，以促进在各种电子设计水平的高速和低功耗应用的各个方面的最新水平。拟议研究的影响将是促进开发新一代多学科框架，以同时分析和验证涵盖所有级别的VLSI设计层次的高速模块，如芯片上、多芯片模块、互连、封装和印刷电路板。预计拟议的研究计划的结果将扩大现有设计平台的视野，同时缩短新产品的设计周期，导致创新的多功能电子和通信产品进入我们的市场，从而使加拿大和全球经济更加健康。**

The rapid advances in the global electronics industry have made the communications and computing products to be part of day-to-day life and highly pervasive. The massive user demand for higher bandwidth and advanced communication as well as better information management are necessitating newer generations of multi-function electronic circuits and systems that operate with lower-power and sharper excitations. ***However, due to such high data rates and the desire for nanoscale designs, high-frequency and high-density related issues are fast becoming the dominant factors limiting the performance of electronic designs. Consequently, it is imperative to note that, the traditional/artificial boundaries between different design disciplines such as circuits, electromagnetics, thermal and mechanical, etc. are fast vanishing and mixed-domain design challenges are emerging. Designers, while being challenged with the increasing need for multiphysics based co-design and co-analysis involving diverse and heterogeneous design modules, are not adequately supported by the currently available design framework and methodologies. To address the above difficulties, following research initiatives are proposed to develop a new-frame work and design methodologies focused on high-speed electronic circuits and systems:****(a) Development of efficient and accurate multiphysics based frameworks for mixed-domain analysis of analog, digital, radio frequency (RF), electromagnetic (EM) and microelectromechanical (MEMS) modules.***(b) Development of signal, power and EMI (electromagnetic interference) co-design and co-analysis methodologies and tools, focusing on advanced interconnect models, power distribution networks and tabulated data based subnetworks.***(c) Development of novel circuit simulation and optimization methodologies with emphasis on exploiting the emerging multicore computational platforms.***The proposed research initiatives are focused on strategic issues, to advance the state-of-the art in various aspects of high-speed and low-power applications in a wide range of electronic design levels. The impact of the proposed research would be to facilitate the development of new generation multidisciplinary framework for concurrent analysis and validation of high-speed modules encompassing all levels of VLSI design hierarchy, such as on-chip, multi-chip modules, interconnects, packages and printed circuit boards. The outcomes of the proposed research initiatives are expected to expand the horizons of existing design platforms while reducing the design cycle time of new products, leading to innovative multi-function electronic and communication products entering our markets, resulting in a healthier Canadian and global economy.**