Managing the Complexity of Multi-Physics based High-Speed Electronic Designs

全球电子工业的快速发展使通信和计算产品成为日常生活的一部分，并且非常普遍。大量用户对更高带宽和先进通信以及更好的信息管理的需求使得新一代的多功能电子电路和系统成为必要，这些电路和系统以更低的功率和更尖锐的激励工作。* 然而，由于如此高的数据速率和对纳米级设计的需求，高频和高密度相关的问题正在迅速成为限制电子设计性能的主要因素。因此，必须注意的是，不同设计学科（如电路、电磁学、热和机械等）之间的传统/人为边界正在迅速消失，混合域设计挑战正在出现。设计师，而面临的挑战与日益增长的需求，多物理场的协同设计和协同分析，涉及不同的和异构的设计模块，没有得到充分的支持，目前可用的设计框架和方法。为了解决上述困难，提出了以下研究倡议，以开发专注于高速电子电路和系统的新框架工作和设计方法：*（a）开发用于模拟、数字、射频（RF）、电磁（EM）和微机电（MEMS）模块的混合域分析的高效和准确的基于多物理场的框架。(b)开发信号、电源和EMI（电磁干扰）协同设计和协同分析方法和工具，重点关注先进的互连模型、配电网络和基于表格数据的子网。(c)开发新的电路仿真和优化方法，重点是利用新兴的多核计算平台。拟议的研究计划重点关注战略问题，以在广泛的电子设计水平中推进高速和低功耗应用各个方面的最新技术。拟议的研究的影响将促进新一代多学科框架的发展，并行分析和验证的高速模块，包括所有级别的VLSI设计层次，如片上，多芯片模块，互连，封装和印刷电路板。拟议的研究计划的成果预计将扩大现有设计平台的视野，同时减少新产品的设计周期，导致创新的多功能电子和通信产品进入我们的市场，从而使加拿大和全球经济更加健康。

The rapid advances in the global electronics industry have made the communications and computing products to be part of day-to-day life and highly pervasive. The massive user demand for higher bandwidth and advanced communication as well as better information management are necessitating newer generations of multi-function electronic circuits and systems that operate with lower-power and sharper excitations. ***However, due to such high data rates and the desire for nanoscale designs, high-frequency and high-density related issues are fast becoming the dominant factors limiting the performance of electronic designs. Consequently, it is imperative to note that, the traditional/artificial boundaries between different design disciplines such as circuits, electromagnetics, thermal and mechanical, etc. are fast vanishing and mixed-domain design challenges are emerging. Designers, while being challenged with the increasing need for multiphysics based co-design and co-analysis involving diverse and heterogeneous design modules, are not adequately supported by the currently available design framework and methodologies. To address the above difficulties, following research initiatives are proposed to develop a new-frame work and design methodologies focused on high-speed electronic circuits and systems:****(a) Development of efficient and accurate multiphysics based frameworks for mixed-domain analysis of analog, digital, radio frequency (RF), electromagnetic (EM) and microelectromechanical (MEMS) modules.***(b) Development of signal, power and EMI (electromagnetic interference) co-design and co-analysis methodologies and tools, focusing on advanced interconnect models, power distribution networks and tabulated data based subnetworks.***(c) Development of novel circuit simulation and optimization methodologies with emphasis on exploiting the emerging multicore computational platforms.***The proposed research initiatives are focused on strategic issues, to advance the state-of-the art in various aspects of high-speed and low-power applications in a wide range of electronic design levels. The impact of the proposed research would be to facilitate the development of new generation multidisciplinary framework for concurrent analysis and validation of high-speed modules encompassing all levels of VLSI design hierarchy, such as on-chip, multi-chip modules, interconnects, packages and printed circuit boards. The outcomes of the proposed research initiatives are expected to expand the horizons of existing design platforms while reducing the design cycle time of new products, leading to innovative multi-function electronic and communication products entering our markets, resulting in a healthier Canadian and global economy.**