High-speed bandpass serial data links

高速带通串行数据链路

• 批准号: 372611-2008
• 负责人: Abhari, Ramesh
• 金额: $ 8.92万
• 依托单位: McGill University
• 依托单位国家: 加拿大
• 项目类别: Idea to Innovation
• 财政年份: 2008
• 资助国家: 加拿大
• 起止时间: 2008-01-01 至 2009-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=411796
• 关键词: speed; bandpass; serial; data; links

Electronic industry has experienced tremendous growth during the past few decades. Nonetheless, for many applications that require ultra-wide band and high-speed signal transmission, electronic circuits have reached their operation envelope. New solutions and design methodologies are needed to enable the next jump in the evolution of electronic systems and to overcome the existing performance bottleneck. Various industry roadmaps have identified interconnects and their lowpass nature as the main factors preventing from reaching these new limits. In this proposal, we propose an alternative solution for signaling in electronic systems by using bandpass interconnects instead of the conventional lowpass ones. We use substrate integrated waveguide type interconnects as the means of data transfer. The bandpass feature of these interconnects brings new system

在过去的几十年里，电子工业经历了巨大的发展。尽管如此，对于需要超宽带和高速信号传输的许多应用，电子电路已经达到其操作包络。需要新的解决方案和设计方法来实现电子系统发展的下一个飞跃，并克服现有的性能瓶颈。各种行业路线图已将互连及其低通特性确定为阻止达到这些新限制的主要因素。在这个建议中，我们提出了一个替代的解决方案，在电子系统中的信号通过使用带通互连，而不是传统的低通。我们使用基片集成波导型互连作为数据传输的手段。这些互连线的带通特性带来了新的系统