High-speed bandpass serial data links

在过去的几十年里，电子工业经历了巨大的发展。尽管如此，对于许多需要超宽带和高速信号传输的应用来说，电子电路已经达到了它们的工作范围。需要新的解决方案和设计方法，以实现电子系统发展的下一次飞跃，并克服现有的性能瓶颈。各种行业路线图已将互联及其低通特性确定为阻止达到这些新限制的主要因素。在该方案中，我们提出了一种替代传统的低通互连的带通互连来解决电子系统中的信令问题。我们使用基片集成波导型互连作为数据传输的手段。这些互连的带通特性带来了新的系统

Electronic industry has experienced tremendous growth during the past few decades. Nonetheless, for many applications that require ultra-wide band and high-speed signal transmission, electronic circuits have reached their operation envelope. New solutions and design methodologies are needed to enable the next jump in the evolution of electronic systems and to overcome the existing performance bottleneck. Various industry roadmaps have identified interconnects and their lowpass nature as the main factors preventing from reaching these new limits. In this proposal, we propose an alternative solution for signaling in electronic systems by using bandpass interconnects instead of the conventional lowpass ones. We use substrate integrated waveguide type interconnects as the means of data transfer. The bandpass feature of these interconnects brings new system