Enabling ultra wideband applications through innovation in design of interconnects, passive elements, and antennas

通过互连、无源元件和天线设计的创新实现超宽带应用

• 批准号: 293220-2009
• 负责人: Abhari, Ramesh
• 金额: $ 2.11万
• 依托单位: McGill University
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2009
• 资助国家: 加拿大
• 起止时间: 2009-01-01 至 2010-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=427364
• 关键词: Enabling; ultra; wideband; applications; through

Electronic industry has dramatically advanced growth during the past few decades but still struggles to achieve the extreme specifications needed in many emerging applications that require ultra-wide band and high-speed signal transmission. The passive back bone of electronic system including interconnects and passive components have been identified as the main factors limiting system performance. Recently published technology roadmaps acknowledge the bandwidth limitation of interconnects and call for dramatic solutions to enable development of next generation electronic systems. In this proposal, an alternative solution for signaling in electronic systems by using bandpass interconnects instead of the conventional lowpass ones is proposed. These bandpass interconnects include substrate integrated waveguide-type structures, wireless interconnects that use antennas for launching and retrieving information and AC coupled interconnects that employ capacitive or inductive coupling for signal transfer. The bandpass feature of these interconnects brings new system capabilities such as wider bandwidth and lower transmission losses for the case of waveguides, and reduced delay and flexibility for the case of wireless interconnects. The AC coupled interconnects provide promising compact system integration capabilities. Each group opens new directions of innovative research for increasing data handling capacity of electronic systems. In this research program, system design considerations such as customizing driver and receiver blocks, dispersion compensation and signal and power integrity evaluations will be investigated. Development of enhanced passive components and integrated antennas, their miniaturization and signal integrity evaluations form another thrust of this research program. Electromagnetic bandgap structures continue to be a key element in engineering new components and power integrity solutions. The ultimate goal of this research is to address the design challenges in deployment of ultra wideband electronic systems.

电子工业在过去几十年中取得了巨大的发展，但仍在努力实现许多新兴应用所需的极端规格，这些应用需要超宽带和高速信号传输。电子系统的无源主干，包括互连和无源元件，已被认为是限制系统性能的主要因素。最近发布的技术路线图承认了互连的带宽限制，并呼吁采取戏剧性的解决方案来开发下一代电子系统。在该方案中，提出了用带通互连代替传统的低通互连来解决电子系统中的信令问题。这些带通互连包括基片集成波导型结构、使用天线发射和检索信息的无线互连以及使用电容或电感耦合进行信号传输的交流耦合互连。这些互连的带通特性带来了新的系统能力，例如，在波导的情况下具有更宽的带宽和更低的传输损耗，在无线互连的情况下减少了延迟和灵活性。交流耦合互连提供了前景看好的紧凑型系统集成能力。每个小组都为提高电子系统的数据处理能力开辟了创新研究的新方向。在本研究计划中，将研究系统设计方面的考虑因素，如定制驱动器和接收器模块、色散补偿以及信号和电源完整性评估。增强型无源元件和集成天线的开发、它们的小型化和信号完整性评估构成了本研究计划的另一个主旨。电磁带隙结构仍然是设计新元件和电源完整性解决方案的关键要素。这项研究的最终目标是解决超宽带电子系统部署中的设计挑战。