Enabling ultra wideband applications through innovation in design of interconnects, passive elements, and antennas

在过去的几十年里，电子行业取得了显著的发展，但仍然难以实现许多新兴应用所需的极端规格，这些应用需要超宽带和高速信号传输。电子系统的无源骨干包括互连线和无源器件，它们是限制系统性能的主要因素。最近公布的技术路线图承认互连的带宽限制，并呼吁戏剧性的解决方案，使下一代电子系统的发展。在这个建议中，提出了一种替代的解决方案，用于电子系统中的信令，通过使用带通互连而不是传统的低通互连。这些带通互连包括衬底集成波导型结构、使用天线来发射和检索信息的无线互连以及采用电容或电感耦合来进行信号传输的AC耦合互连。这些互连的带通特征带来了新的系统能力，例如波导的情况下的更宽的带宽和更低的传输损耗，以及无线互连的情况下的减少的延迟和灵活性。交流耦合互连提供了有前途的紧凑的系统集成能力。每个小组都开辟了创新研究的新方向，以提高电子系统的数据处理能力。在这项研究计划中，系统设计的考虑因素，如定制驱动器和接收器块，色散补偿和信号和电源完整性评估将进行调查。增强型无源元件和集成天线的发展，其小型化和信号完整性评估形成了该研究计划的另一个重点。电磁带隙结构仍然是工程新组件和电源完整性解决方案的关键要素。本研究的最终目标是解决超宽带电子系统部署中的设计挑战。

Electronic industry has dramatically advanced growth during the past few decades but still struggles to achieve the extreme specifications needed in many emerging applications that require ultra-wide band and high-speed signal transmission. The passive back bone of electronic system including interconnects and passive components have been identified as the main factors limiting system performance. Recently published technology roadmaps acknowledge the bandwidth limitation of interconnects and call for dramatic solutions to enable development of next generation electronic systems. In this proposal, an alternative solution for signaling in electronic systems by using bandpass interconnects instead of the conventional lowpass ones is proposed. These bandpass interconnects include substrate integrated waveguide-type structures, wireless interconnects that use antennas for launching and retrieving information and AC coupled interconnects that employ capacitive or inductive coupling for signal transfer. The bandpass feature of these interconnects brings new system capabilities such as wider bandwidth and lower transmission losses for the case of waveguides, and reduced delay and flexibility for the case of wireless interconnects. The AC coupled interconnects provide promising compact system integration capabilities. Each group opens new directions of innovative research for increasing data handling capacity of electronic systems. In this research program, system design considerations such as customizing driver and receiver blocks, dispersion compensation and signal and power integrity evaluations will be investigated. Development of enhanced passive components and integrated antennas, their miniaturization and signal integrity evaluations form another thrust of this research program. Electromagnetic bandgap structures continue to be a key element in engineering new components and power integrity solutions. The ultimate goal of this research is to address the design challenges in deployment of ultra wideband electronic systems.