Foundational modelling and design techniques for RF, mm/THz, and photonic devices and their applications

创新的电磁（RF， mm/THz和光）波处理结构已成为未来几代高性能，智能和可重构的无线电/传感器系统和网络的关键子系统。集成低轮廓的辐射元件与紧凑和高度集成的多标准电路封装，以最小的杂散发射，磁化率，和有害的相互作用与电路的关键部分，已成为一个极具挑战性的任务，在许多新产品的开发计划。集成天线的设计与诊断、抗辐射封装/外壳的设计与开发、辐射元件与封装之间相互作用的分析与表征、新型集成光波导中的传播建模是最复杂的电磁问题之一。对电子和光学融合的渴望，导致了硅光子学技术的发展，为电磁建模研究提供了另一项具有挑战性的任务。目前的建议继续建立在我们过去在这一研究领域取得的成功的基础上，以解决上述挑战性任务的最新基础方面。

Innovative electromagnetic (RF, mm/THz and Optical) wave processing structures have become a critical subsystem in future generations of high performance, intelligent and reconfigurable radio/sensor system and networks. Integration of low profile radiating elements with compact and highly integrated multi-standard circuit packages, with minimum spurious emission, susceptibility, and harmful interaction with the critical parts of the circuit, has become an extremely challenging task in many new product development plans. Integrated antenna design and diagnosis, design and development of radiation resistant package/enclosure, analysis and characterization of interaction between the radiating elements and package, propagation modelling in novel integrated optical guides are among the most complex electromagnetic problems. Desire for the convergence of electronics and optics, leading to the silicon-photonics technology, provides another challenging task for the EM modelling research. The current proposal continues to build on our past successes in this field of research to address the latest foundational aspects of the challenging tasks outlined above.