Foundational modelling and design techniques for RF, mm/THz, and photonic devices and their applications

创新的电磁（RF、mm/THz和光学）波处理结构已经成为未来几代高性能、智能和可重构无线电/传感器系统和网络的关键子系统。在许多新产品开发计划中，将低轮廓辐射元件与紧凑且高度集成的多标准电路封装集成，同时将杂散发射、敏感性和与电路关键部件的有害相互作用降至最低，已成为一项极具挑战性的任务。集成天线的设计和诊断，抗辐射封装/外壳的设计和开发，辐射元件和封装之间的相互作用的分析和表征，新型集成光导中的传播建模是最复杂的电磁问题之一。电子学和光学的融合，导致硅光子学技术的愿望，提供了另一个具有挑战性的任务的EM建模研究。目前的建议继续建立在我们过去在这一研究领域的成功，以解决上述具有挑战性的任务的最新基础方面。

Innovative electromagnetic (RF, mm/THz and Optical) wave processing structures have become a critical subsystem in future generations of high performance, intelligent and reconfigurable radio/sensor system and networks. Integration of low profile radiating elements with compact and highly integrated multi-standard circuit packages, with minimum spurious emission, susceptibility, and harmful interaction with the critical parts of the circuit, has become an extremely challenging task in many new product development plans. Integrated antenna design and diagnosis, design and development of radiation resistant package/enclosure, analysis and characterization of interaction between the radiating elements and package, propagation modelling in novel integrated optical guides are among the most complex electromagnetic problems. Desire for the convergence of electronics and optics, leading to the silicon-photonics technology, provides another challenging task for the EM modelling research. The current proposal continues to build on our past successes in this field of research to address the latest foundational aspects of the challenging tasks outlined above.