Development of Solid-state cooling chips

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Development of Solid-state cooling chips. The performance of modern electronic, microelectronic, optoelectronic and photonic devices improves as they are cooled. We aim to develop semiconductor cooling elements that can be directly integrated into existing circuits and devices. The new solid-state cooling elements will be reliable, robust, scalable and operate in any orientation. The proposed international collaboration combines the expertise of the Chinese Academy of Science in device fabrication with the expertise of the University of Wollongong in device characterisation and modelling. The outcome of this research has the potential to revolutionize cooling of diverse electronic systems, from computer motherboards to mobile phones.