Development of Solid-state cooling chips

固态散热芯片的开发

• 批准号: ARC : LX0240472
• 负责人: Chao Zhang
• 金额: $ 2.12万
• 依托单位: University of Wollongong
• 依托单位国家: 澳大利亚
• 项目类别: Linkage - International
• 财政年份: 2002
• 资助国家: 澳大利亚
• 起止时间: 2002-01-01 至 2004-12-31
• 项目状态: 已结题
• 来源: https://researchdata.edu.au/development-solid-state-cooling-chips/75771
• 关键词: Development; Solid; state; cooling; chips

Development of Solid-state cooling chips. The performance of modern electronic, microelectronic, optoelectronic and photonic devices improves as they are cooled. We aim to develop semiconductor cooling elements that can be directly integrated into existing circuits and devices. The new solid-state cooling elements will be reliable, robust, scalable and operate in any orientation. The proposed international collaboration combines the expertise of the Chinese Academy of Science in device fabrication with the expertise of the University of Wollongong in device characterisation and modelling. The outcome of this research has the potential to revolutionize cooling of diverse electronic systems, from computer motherboards to mobile phones.

固态冷却芯片的研制。现代电子、微电子、光电子和光子器件的性能随着它们的冷却而提高。我们的目标是开发可以直接集成到现有电路和设备中的半导体冷却元件。新的固态冷却元件将是可靠的，坚固的，可扩展的，并在任何方向上运行。拟议中的国际合作将中国科学院在器件制造方面的专业知识与卧龙岗大学在器件表征和建模方面的专业知识相结合。这项研究的成果有可能彻底改变从电脑主板到移动的手机等各种电子系统的冷却方式。