Development of energetic nanomaterials for microelectronics applications

点击翻译按钮获取中文摘要

For more than 50 years, the gold and copper wires have been used in microelectronics industry for information transfer between individual electronic components on silicon chips. These wires, acting as data highways and usually less than half the diameter of a human hair, are welded at each of its ends on the base board. Because the dense wires could touch one another and cause electrical short circuit, an insulation layer has been developed and coated on wires' surface. For copper wires, however, because their hardness is greater and they are easily oxidized in air, a novel process is needed to provide the excessive heat to melting the coating layer as well as to join the wire and the base board. The proposed research will explore the utilization of energetic nanomaterials (nanocomposite and core-shell nanoparticles) in the development of advanced wire bonding processes for portable microelectronics. Once ignited these nanomaterials, also called nano thermite, could release a great amount of energy in a few milliseconds. The power generated in this way will facilitate the wire