Sensitive synthetic dry adhesives for pick and place application in MEMS

点击翻译按钮获取中文摘要

We are proposing the integration of novel bio-inspired adhesives into the end-effectors of robotic pick and place systems for assembly and packaging of MEMS and microfluidics. One of the most challenging issues for commercialization of MEMS or microfluidics is the final packaging of the microfabricated die. Each individual die must be carefully placed in a package containing electrical or microfluidic interconnections, sealed and bonded. Traditionally, pick and place robots have used active suction to hold die in place while moving them into position, but this requires active pneumatics, a complex end effector tip and can potentially damage devices with freely moving parts, as in the case with MEMS. Normal adhesives cannot be used because they are not switchable, and traditional tacky materials will leave residues on the surfaces of MEMS