Modeling moisture diffusion coupled with physical aging phenomena in thin-wall polymeric parts

模拟薄壁聚合物部件中的湿气扩散与物理老化现象

• 批准号: 385427-2009
• 负责人: Sullivan, Pearl(Lee)
• 金额: $ 2.72万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2011
• 资助国家: 加拿大
• 起止时间: 2011-01-01 至 2012-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=485038
• 关键词: Modeling; moisture; diffusion; coupled; physical

This proposal is a continuation of a collaboration with an industrial partner who designs and manufactures wireless handheld devices. This is a highly competitive industry which is rapidly moving towards increasingly thinner walls for its plastic housings and electronic components due to aggressive miniaturization. It is well known that polymeric materials are sensitive to moisture and temperature but there is much uncertainty about how they would age under conditions encountered in service. The mechanical and physical properties of polymeric materials also change profoundly with aging but the extent of these changes and how they may adversely affect the reliability of critical components cannot be readily predicted as yet.

该提案是与设计和制造无线手持设备的工业伙伴合作的延续。这是一个竞争激烈的行业，由于积极的小型化，塑料外壳和电子元件的壁越来越薄。众所周知，聚合物材料对湿度和温度很敏感，但在使用条件下，它们会如何老化还存在很多不确定性。聚合物材料的机械和物理性能也会随着老化而发生深刻的变化，但这些变化的程度以及它们如何对关键部件的可靠性产生不利影响，目前还无法轻易预测。