Modeling moisture diffusion coupled with physical aging phenomena in thin-wall polymeric parts

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This proposal is a continuation of a collaboration with an industrial partner who designs and manufactures wireless handheld devices. This is a highly competitive industry which is rapidly moving towards increasingly thinner walls for its plastic housings and electronic components due to aggressive miniaturization. It is well known that polymeric materials are sensitive to moisture and temperature but there is much uncertainty about how they would age under conditions encountered in service. The mechanical and physical properties of polymeric materials also change profoundly with aging but the extent of these changes and how they may adversely affect the reliability of critical components cannot be readily predicted as yet.