Automated Silicon Photonics RF/Optical Probe Stations

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This proposal is for test equipment for Silicon Electronic-Photonic Integrated Circuits (Si-EPICs). Specifically, the grant is for: a) three identical automated silicon photonic circuit characterization systems, to be located at McGill, UBC, and Ottawa University; and b) a wire-bonder for CMOS electronic-silicon photonic chip integration. Globally, we are on the cusp of revolutionary changes in communication and Microsystems technology through the marriage of photonics (manipulation of information using light, or photons) and electronics (information processing using electrical current) on a single platform (silicon). How is this relevant to society? We have witnessed that the concept of integration is exceedingly important in the success of numerous products. For example, smartphones such as the Blackberry and iPhone, are both incredibly thin and highly functional. The miniaturization of optical components onto silicon chips ("silicon photonics") will enable tremendous developments akin to the smartphone. Electronic-photonic circuits will play a ubiquitous role globally, impacting such areas as high-speed communications for mobile devices (smartphones, tablets), optical communications within computers and within data centres (e.g., Google), sensor systems, and medical applications. The requested equipment will support our research program, one that emphasizes student design of "commercializable" single-chip systems for far-reaching industry-relevant applications.