Development of novel palladium coated bonding wire for microelectronics

微电子用新型镀钯键合线的研制

• 批准号: 439273-2012
• 负责人: Mayer, Michael
• 金额: $ 1.68万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2012
• 资助国家: 加拿大
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=498334
• 关键词: Development; novel; palladium; coated; bonding

Fine wire bonds are used primarily to form electrical connections to semiconductor devices such as microcircuits or light emitting diodes. Gold (Au) is the most commonly used wire material for such bonds due to its favorable properties. Copper (Cu) wire is a lower cost, more conductive alternative. However, Cu wire is harder and oxidizes during bonding which leads to the semiconductor being destroyed in many applications.

细线接合主要用于形成与微电路或发光二极管等半导体器件的电连接。由于其良好的特性，金 (Au) 是此类键合中最常用的线材。铜 (Cu) 线是一种成本更低、导电性更强的替代品。然而，铜线较硬，在键合过程中会氧化，导致半导体在许多应用中被破坏。