Metallizing technologies for organometallic liquids
有机金属液体金属化技术
基本信息
- 批准号:493701-2016
- 负责人:
- 金额:$ 1.66万
- 依托单位:
- 依托单位国家:加拿大
- 项目类别:Collaborative Research and Development Grants
- 财政年份:2017
- 资助国家:加拿大
- 起止时间:2017-01-01 至 2018-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The research project "Metallizing Technologies for Organometallic Liquids" is a collaboration with the University of Waterloo and Microbonds Inc., Markham, ON, that aims at developing new processes to apply thin film metallic layers to a variety of surfaces. These processes depend on newly developed organometallic liquids from Microbonds. The research project at the University of Waterloo is divided in three subprojects: liquid film deposition and curing, characterization, and demonstrations of applications. Up to four students receive training on this project in thin film technology, electronic packaging techniques, experimental systems design, professional communication and project execution, and analytical tools. In collaboration with Microbonds, they will learn about commercialization issues, mass production requirements, and intellectual property strategies. These skills prepare them well for jobs in the fields of microelectronics, microsystems, internet-of-things, and others. The expected benefits include new knowledge and technology for surface metallizations which will be transferred to the partner company, patented, and published. Due to the atomistic nature of metallizations from Microbonds' organometallic liquids, more robust and reliable metallizations are expected. A variety of applications with increase quality and low cost are possible in fields such as advanced microsystems, electronics, medical devices, automotive, internet of things (IoT), wearables, functional fabrics, and electronic garments. The new metallizations also have the potential to minimize the environmental impact compared to some existing technologies.
研究项目“有机金属化技术”是与滑铁卢大学和微债券公司合作,Markham,ON,旨在开发将薄膜金属层应用于各种表面的新工艺。这些过程依赖于Microbonds新开发的有机金属液体。滑铁卢大学的研究项目分为三个子项目:液膜沉积和固化,表征和应用演示。多达四名学生接受培训,在薄膜技术,电子封装技术,实验系统设计,专业沟通和项目执行,以及分析工具的这个项目。在与微债券合作,他们将了解商业化问题,大规模生产的要求,和知识产权战略。这些技能为他们在微电子,微系统,物联网等领域的工作做好了准备。预期收益包括表面金属化的新知识和技术,这些知识和技术将转让给合作伙伴公司,获得专利并出版。由于Microbonds的有机金属液体金属化的原子性质,预期更坚固和可靠的金属化。在诸如先进微系统、电子、医疗设备、汽车、物联网(IoT)、可穿戴设备、功能性织物和电子服装等领域中,可以实现具有提高的质量和低成本的各种应用。与一些现有技术相比,新的金属化也有可能最大限度地减少对环境的影响。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Mayer, Michael其他文献
Films of agarose enable rapid formation of giant liposomes in solutions of physiologic ionic strength.
- DOI:
10.1021/ja805625u - 发表时间:
2009-02-11 - 期刊:
- 影响因子:15
- 作者:
Horger, Kim S.;Estes, Daniel J.;Capone, Ricardo;Mayer, Michael - 通讯作者:
Mayer, Michael
Agentic and communal narcissism in predicting different types of lies in romantic relationships.
- DOI:
10.3389/fpsyg.2023.1146732 - 发表时间:
2023 - 期刊:
- 影响因子:3.8
- 作者:
Harhoff, Nico;Reinhardt, Nina;Reinhard, Marc-Andre;Mayer, Michael - 通讯作者:
Mayer, Michael
Simultaneous Determination of the Size and Shape of Single α-Synuclein Oligomers in Solution.
同时测定溶液中单α-突触核蛋白低聚物的大小和形状。
- DOI:
10.1021/acsnano.3c01393 - 发表时间:
2023-07-11 - 期刊:
- 影响因子:17.1
- 作者:
Awasthi, Saurabh;Ying, Cuifeng;Li, Jiali;Mayer, Michael - 通讯作者:
Mayer, Michael
PAMAM dendrimers: A multifunctional nanomaterial for ECL biosensors
- DOI:
10.1016/j.talanta.2017.03.016 - 发表时间:
2017-06-01 - 期刊:
- 影响因子:6.1
- 作者:
Chandra, Sudeshna;Mayer, Michael;Baeumner, Antje J. - 通讯作者:
Baeumner, Antje J.
Designing nanosensors based on charged derivatives of gramicidin A
- DOI:
10.1021/ja0711819 - 发表时间:
2007-08-08 - 期刊:
- 影响因子:15
- 作者:
Capone, Ricardo;Blake, Steven;Mayer, Michael - 通讯作者:
Mayer, Michael
Mayer, Michael的其他文献
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{{ truncateString('Mayer, Michael', 18)}}的其他基金
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
超声波焊接中微焊缝的引发和生长模型
- 批准号:
RGPIN-2018-04338 - 财政年份:2022
- 资助金额:
$ 1.66万 - 项目类别:
Discovery Grants Program - Individual
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
超声波焊接中微焊缝的引发和生长模型
- 批准号:
RGPIN-2018-04338 - 财政年份:2021
- 资助金额:
$ 1.66万 - 项目类别:
Discovery Grants Program - Individual
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
超声波焊接中微焊缝的引发和生长模型
- 批准号:
RGPIN-2018-04338 - 财政年份:2020
- 资助金额:
$ 1.66万 - 项目类别:
Discovery Grants Program - Individual
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
超声波焊接中微焊缝的引发和生长模型
- 批准号:
RGPIN-2018-04338 - 财政年份:2019
- 资助金额:
$ 1.66万 - 项目类别:
Discovery Grants Program - Individual
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
超声波焊接中微焊缝的引发和生长模型
- 批准号:
RGPIN-2018-04338 - 财政年份:2018
- 资助金额:
$ 1.66万 - 项目类别:
Discovery Grants Program - Individual
Metallizing technologies for organometallic liquids
有机金属液体金属化技术
- 批准号:
493701-2016 - 财政年份:2018
- 资助金额:
$ 1.66万 - 项目类别:
Collaborative Research and Development Grants
Development of Wire Bonding Process and Reliability Evaluation for Gold coated Selenium
镀金硒引线键合工艺开发及可靠性评估
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517995-2017 - 财政年份:2017
- 资助金额:
$ 1.66万 - 项目类别:
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Resistance monitoring of novel solders during processing and operation at high temperatures
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486412-2015 - 财政年份:2015
- 资助金额:
$ 1.66万 - 项目类别:
Engage Grants Program
Development of novel palladium coated bonding wire for microelectronics
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- 批准号:
439273-2012 - 财政年份:2014
- 资助金额:
$ 1.66万 - 项目类别:
Collaborative Research and Development Grants
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将微丝粘合到精致基材上的温和方法
- 批准号:
312543-2010 - 财政年份:2014
- 资助金额:
$ 1.66万 - 项目类别:
Discovery Grants Program - Individual
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