Resistance monitoring of novel solders during processing and operation at high temperatures

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Solders are ubiquitous in electronic products and methods to improve the performance and lower the cost of lead-free solders are needed in many industries (electronics, automotive, medical, aerospace, etc.). Alloying elements to existing lead-free solders is a way to alter solder performance. Many elements can be added to existing solder alloys and the number of possible alloying combinations is so large that finding the best combination is impossible with conventional means. The development of an in situ measurement method for solder resistance is proposed to accelerate the assessment of novel solder alloys leading to a larger number of alloying combinations to be tested for a given time. This will increase the chances of finding new solders with improved performance. The proposed project will develop an automated characterization setup for the new method to increase the number of solder samples that can be assessed. In contrast to conventional methods of reliability analysis which involve the cross-sectioning of samples, the new method will be employed during reflow and during reliability testing, leading to improved data and a better understanding of the failure mechanisms of joints made with novel solder alloys, and ultimately helping the quest for improved solder joints of the future.