Resistance monitoring of novel solders during processing and operation at high temperatures

焊料在电子产品中无处不在，并且在许多行业（电子、汽车、医疗、航空航天等）中需要改善无铅焊料的性能并降低其成本的方法。在现有的无铅焊料中加入合金元素是改变焊料性能的一种方法。许多元素可以添加到现有的焊料合金中，并且可能的合金组合的数量如此之大，以至于用常规方法不可能找到最佳组合。 焊料电阻的原位测量方法的发展，提出了加速评估新的焊料合金，导致大量的合金组合进行测试，在给定的时间。这将增加找到具有改进性能的新焊料的机会。拟议项目将为新方法开发一种自动化表征设置，以增加可评估的焊料样品数量。与涉及样品横截面的传统可靠性分析方法相比，新方法将在回流焊和可靠性测试期间使用，从而改善数据并更好地了解新型焊料合金制成的接头的失效机制，并最终帮助寻求未来的改进焊点。

Solders are ubiquitous in electronic products and methods to improve the performance and lower the cost of lead-free solders are needed in many industries (electronics, automotive, medical, aerospace, etc.). Alloying elements to existing lead-free solders is a way to alter solder performance. Many elements can be added to existing solder alloys and the number of possible alloying combinations is so large that finding the best combination is impossible with conventional means. The development of an in situ measurement method for solder resistance is proposed to accelerate the assessment of novel solder alloys leading to a larger number of alloying combinations to be tested for a given time. This will increase the chances of finding new solders with improved performance. The proposed project will develop an automated characterization setup for the new method to increase the number of solder samples that can be assessed. In contrast to conventional methods of reliability analysis which involve the cross-sectioning of samples, the new method will be employed during reflow and during reliability testing, leading to improved data and a better understanding of the failure mechanisms of joints made with novel solder alloys, and ultimately helping the quest for improved solder joints of the future.