High Strain Rate Fracture of Solder Joints and Underfill Adhesives

焊点和底部填充胶的高应变率断裂

• 批准号: 401218-2010
• 负责人: Spelt, Jan
• 金额: $ 2.55万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2012
• 资助国家: 加拿大
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=498432
• 关键词: Strain; Rate; Fracture; Solder; Joints

At present, the strength of solder joints and adhesive used to connect components to circuit boards in electronics devices cannot be predicted, and extensive testing and experience are required to design reliable products. This is particularly true for portable devices subject to impact loads if they are dropped.

目前，用于将电子设备中的元件连接到电路板的焊点和粘合剂的强度无法预测，并且需要大量的测试和经验来设计可靠的产品。这对于在跌落时经受冲击载荷的便携式设备尤其如此。