Creep modeling of precision adhesive joints in opto-electronic devices

光电器件中精密粘合接头的蠕变建模

• 批准号: 463690-2014
• 负责人: Spelt, Jan
• 金额: $ 1.42万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2014
• 资助国家: 加拿大
• 起止时间: 2014-01-01 至 2015-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=558549
• 关键词: Creep; modeling; precision; adhesive; joints

Opto-electronic devices consist of optical elements attached to a substrate; the most common method of fixing these components to the substrate is by means of adhesives. Adhesives are susceptible to creep and stress relaxation under the influence of internal and external stresses, which may lead to subtle perturbation of the position of optical components, thereby affecting performance over time. Opto-mechanical design needs to account for this end of life (EOL) behavior of precision adhesive bonds. There is a lack of predictive model for designing against these mechanisms, leading to rule-of-thumb design criteria and material selection processes.

光电器件由附着在基板上的光学元件组成;将这些元件固定到基板上的最常见方法是通过粘合剂。在内部和外部应力的影响下，粘合剂易受蠕变和应力松弛的影响，这可能导致光学部件位置的细微扰动，从而随着时间的推移影响性能。光学机械设计需要考虑精密粘合剂粘结的这种寿命终止（EOL）行为。缺乏针对这些机制进行设计的预测模型，导致经验法则设计标准和材料选择过程。