Development of 3D strain gauge sensor for structural health monitoring of aging critical systems

该项目的重点是用于结构健康远程监测(SHM)应用的3D应力/应变测量的新型微电子机械系统(MEMS)传感器的原型阶段。经过验证的传感机制利用硅压阻式元件构建了一个微型传感芯片，可以监测应变结构表面的三维应力和应变。利用微组装倒装芯片技术，利用电子电路、遥测系统和电源将该SHRM芯片构建成一个可以与远程监测站进行无线通信的微封装传感芯片。这种结构健康远程监测(SHRM)技术为目前市场上可用的微型应变计增加了许多好处。MEMS应变传感器(1)兼容于与无线和数据处理电路的精细间距集成，(2)以更低的功耗(1-50 mW)耐用运行，(3)能够以增强的远场/近场应变比进行传感，(4)具有独特的3D应力/应变提取能力，以监控负责传感器解接的面外应力。提出的基于MEMS的应变传感技术的初步构想已经得到了分析和实验的验证。这项I2I第一阶段的提案将专注于准备一个可用于现场测试传感芯片的原型。随着这一阶段的成功，我们计划通过第二阶段推进我们的商业化计划。传感芯片将通过与大学商业化办公室合作的公司剥离进行商业化。该公司拥有广阔的潜在市场，几家工业企业已表示有兴趣并支持在其位于艾伯塔省的油砂开采设备和应变测量系统上部署MEMS应力传感器。

This project focus on the prototyping phase of a new Micro-Electro-Mechanical-System (MEMS)-based sensor for 3D stress/strain measurements intended for Structural Health Remote Monitoring (SHM) applications. The verified sensing mechanism utilizes silicon piezoresistive elements to construct a micro sensing chip that can monitor the 3D stresses and strains on a strained structure surface. A micro assembly flip chip technique is utilized to construct this SHRM chip using electronic circuitry, telemetry system, and power source into one micro-packaged sensory chip that can communicate wirelessly with a remote monitoring station. This structural health remote monitoring (SHRM) technology adds many benefits to the micro strain gauges currently available in the market. The MEMS strain sensor (1) is CMOS compatible for fine pitch integration with wireless and data processing circuitry, (2) operates with durable lower power consumption (1-50mW), (3) is able to sense with enhanced far/near field strain ratio and (4) has a unique capability of 3D stress/strain extraction to monitor out-of-plane stresses responsible for sensor de-bonding. The initial concept of the proposed MEMS- based strain sensory technique has been verified analytically and experimentally. This I2I phase I proposal will focus on preparing a prototype that can be used for beta field testing the sensory chip. With the success of this phase, we plan to move forward with our commercialization plan through Phase II. The sensory chip will be commercialized through a company spin-off in collaboration with the university commercialization office. With a wide potential market, where several industrial parties has expressed their interest and support in deploying the MEMS stress sensor on their oil sands mining equipment and strain measurement systems in Alberta.