A novel MEMS based 3D micro load cell utilization in emerging technologies

一种开发的3D MEMS称重传感器(3DMLC)被用于广泛的触觉传感应用。3DMLC代表了一种3D微型称重传感器，能够利用独特的压阻传感系统检测多达六个轴的载荷。与现有的负载检测和触觉技术相比，所开发的3DMLC具有体积小、灵敏度显著提高和功耗降低的特点。这些优势将使其在多维力和力矩检测方面的能力被用于许多新兴的触觉传感应用。该项目将专注于3DML传感器和封装设计的优化、初级和高级原型的微制造、原型的质量控制和表征、紧凑型封装中的微组装、面向客户的非现场验证以及商业化产品的批量生产可行性研究阶段。

A developed 3D MEMS Load Cell (3DMLC) Sensor is utilized for a wide range of haptic sensing applications. The 3DMLC represent as a 3D micro load cell capable of detecting up to six-axis loading utilizing unique distribution of piezoresistive sensing regimes. Compared to existing load detecting and haptic technologies, the developed 3DMLC offers size reduction, significant increase in sensitivity and decrease in power consumption. These advantages will allow for its capacity in multi-dimensional force and moment detection to be utilized in many emerging haptic sensing applications. This project will focus on the optimization of the 3DML sensor and packaging designs, the microfabrication of preliminary and advanced prototypes, quality control and characterization of prototypes, microassembly in compact packages, off-site customer-oriented validation and volume production feasibility study phase toward commercial level product.