In-chip communication using UWB for 3D integration

使用 UWB 进行片内通信进行 3D 集成

• 批准号: 238970-2008
• 负责人: Dinh, Anh
• 金额: $ 1.09万
• 依托单位: University of Saskatchewan
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2012
• 资助国家: 加拿大
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=503467
• 关键词: chip; communication; using; UWB; 3D

The current trend toward a new class of products called convergent system integrates many functions (voice, video and data) and many different technologies (digital, RF, analog and optical) into one. This trend can be visualized with four approaches: system-on-chip (SOC), multichip module (MCM), system-in-package (SIP) and system-on-package (SOP). The architecture in 3-D integrated circuits provides a convergent system, the many-in-one package, with good performance and less power. There must be interconnections between the dies or chips within the system for communication purposes. Wireless interconnection has been proven outperforming the wire communication in the ICs since it provides high speed with more compact and lower cost for multi-function IC's.

目前的趋势是一种新的产品类别，称为融合系统，将许多功能（语音，视频和数据）和许多不同的技术（数字，射频，模拟和光学）集成为一体。这种趋势可以通过四种方法来可视化：片上系统（SOC），多芯片模块（MCM），系统级封装（SIP）和系统级封装（SOP）。三维集成电路的架构提供了一个融合系统，即多合一封装，具有良好的性能和更低的功耗。为了通信的目的，在系统内的模或芯片之间必须有互连。无线互连在集成电路中的应用已被证明优于有线通信，因为它为多功能集成电路提供了更高的速度，更紧凑和更低的成本。