In-chip communication using UWB for 3D integration

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The current trend toward a new class of products called convergent system integrates many functions (voice, video and data) and many different technologies (digital, RF, analog and optical) into one. This trend can be visualized with four approaches: system-on-chip (SOC), multichip module (MCM), system-in-package (SIP) and system-on-package (SOP). The architecture in 3-D integrated circuits provides a convergent system, the many-in-one package, with good performance and less power. There must be interconnections between the dies or chips within the system for communication purposes. Wireless interconnection has been proven outperforming the wire communication in the ICs since it provides high speed with more compact and lower cost for multi-function IC's.