A cost-effective process for low-loss light coupling between optical fibres and integrated photonic circuits with high refractive

随着绝缘体上硅(SOI)衬底的出现，硅光电子(SiP：在硅芯片上制造的基于光的系统)正在为微电子行业开辟道路，为电信行业制造可靠、紧凑和低成本的光电子设备。各种功能可以在SOI上实现，具有非常高的性能水平。然而，采用高效而低成本的技术将光纤携带的输入/输出光耦合到光电子芯片/从光电子芯片耦合仍然是大规模市场采用SIP产品的最大障碍之一。 本项目旨在通过完成开发一种具有成本效益和效率的光纤和sip芯片之间的光耦合技术来满足这一需要。这项技术已经在舍布鲁克大学(UDES)开发，并受到PCT专利申请的保护。第一代设备展示了非常有希望的结果。这项I2I提案旨在通过使用与行业兼容的方法优化微制造工艺来完成开发，并展示该技术如何满足或超过电信行业为批量生产和市场接受而设定的要求。 我们的工作已经吸引了一家魁北克公司的兴趣，因此这个项目的结果对加拿大有很大的潜在好处。

With the advent of silicon-on-insulator (SOI) substrates, silicon photonics ("SiP": light-based systems fabricated on a silicon chip) is opening the way in the microelectronics industry to the fabrication of reliable, compact and low-cost photonics devices for the telecom industry. A wide range of functions can be implemented on SOI with very high levels of performance. However, adoption of an efficient yet low-cost technology for coupling input/output light carried by optical fibres to/from photonics chips remains one of the biggest obstacles to large-scale market adoption of SiP products. The present project aims to address this need by completing the development of a cost-effective and efficient technology for coupling light between optical fibres and SiP chips. This technology has been developed at the Université de Sherbrooke (UdeS) and protected by a PCT patent application. First-generation devices exhibit very promising results. This I2I proposal aims to complete the development by optimizing the microfabrication process using industry-compatible methods and demonstrating how the technology meets or surpasses the requirements set by the telecommunications industry for mass-production and market acceptance. Our work has already attracted the interest of a Quebec-based company, the outcome of this project thus has strong potential benefits for Canada.