Silver nanopastes for electronic packaging: Joining mechanism and applications

微邦德公司是加拿大微型加工行业的领先公司，拥有 在半导体封装和微芯片领域开发绝缘键合导线技术 工业。该公司的X-WireTM技术使开发更快、更小和更便宜的 微芯片，同时提高制造可靠性。利用微键技术开发的纳米银可以 不仅用作纳米级薄膜涂层，还用作填充材料，在相对较低的温度下将铜与铜结合 低温，甚至是室温。这将扩大产品和加工能力， 微电子封装。铜的低温连接机理的探讨 为了更好地理解连接，需要纳米银及其在电子封装中的应用 进程。微邦德正在寻求与该大学的禤浩焯·格利希教授进行研究合作 进行所需的研究并确定促进电子设备的处理窗口 使用纳米银进行包装。该项目完成后，微邦德公司将利用这一成果和 在探索新的包装技术方面获得的知识，并评估进一步追求的可能性 与Gerlich教授一起参与和描述研究活动。

Microbonds Incorporation is a leading company in the Canadian micro-scale processing industry having developed insulated bonding wire technologies in the areas of semiconductor packaging and microchip industries. The company's X-WireTM Technology enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability. The silver nanopaste developed by Microbonds can be used not only as a nanoscale thin-film coating but also as a filler material to bond copper to copper at relatively low temperatures, or even room temperature. This will expand the products and processing capability for micro-electronic packaging. An exploratory study of the low temperature joining mechanism of copper using the silver nanopaste and its application in electronic packaging is needed to better understand the joining process. Microbonds is seeking to engage in research collaboration with Prof. Adrian Gerlich at the University of Waterloo to perform the required research and identify a processing window facilitating electronic packaging using silver nanopaste. Upon completion of this project Microbonds will utilize the results and knowledge gained in exploring new packaging technology and evaluate the possibility of pursuing further joining and characterization research activities with Prof. Gerlich.