Silver nanopastes for electronic packaging: Joining mechanism and applications

点击翻译按钮获取中文摘要

Microbonds Incorporation is a leading company in the Canadian micro-scale processing industry having developed insulated bonding wire technologies in the areas of semiconductor packaging and microchip industries. The company's X-WireTM Technology enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability. The silver nanopaste developed by Microbonds can be used not only as a nanoscale thin-film coating but also as a filler material to bond copper to copper at relatively low temperatures, or even room temperature. This will expand the products and processing capability for micro-electronic packaging. An exploratory study of the low temperature joining mechanism of copper using the silver nanopaste and its application in electronic packaging is needed to better understand the joining process. Microbonds is seeking to engage in research collaboration with Prof. Adrian Gerlich at the University of Waterloo to perform the required research and identify a processing window facilitating electronic packaging using silver nanopaste. Upon completion of this project Microbonds will utilize the results and knowledge gained in exploring new packaging technology and evaluate the possibility of pursuing further joining and characterization research activities with Prof. Gerlich.