Silver nanopastes for electronic packaging: Joining mechanism and applications

Microbonds Incorporation是加拿大微型加工行业的领先公司， 在半导体封装和微芯片领域开发绝缘键合线技术 行业该公司的X-WireTM技术能够开发更快、更小、更便宜的 微芯片，同时提高制造可靠性。Microbonds开发的银纳米膏可以 不仅用作纳米级薄膜涂层，而且还用作填充材料，以相对较低的温度将铜结合到铜上。 低温，甚至室温。这将扩大产品和加工能力， 微电子封装铜的低温连接机理的探讨 需要银纳米膏及其在电子封装中的应用来更好地理解连接 过程Microbonds正在寻求与该大学的Adrian Gerlich教授进行研究合作 滑铁卢执行所需的研究，并确定一个处理窗口，促进电子 使用银纳米膏包装。该项目完成后，微债券将利用其结果， 在探索新的包装技术中获得的知识，并评估进一步追求的可能性 加入和表征研究活动与教授Gerlich。

Microbonds Incorporation is a leading company in the Canadian micro-scale processing industry having developed insulated bonding wire technologies in the areas of semiconductor packaging and microchip industries. The company's X-WireTM Technology enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability. The silver nanopaste developed by Microbonds can be used not only as a nanoscale thin-film coating but also as a filler material to bond copper to copper at relatively low temperatures, or even room temperature. This will expand the products and processing capability for micro-electronic packaging. An exploratory study of the low temperature joining mechanism of copper using the silver nanopaste and its application in electronic packaging is needed to better understand the joining process. Microbonds is seeking to engage in research collaboration with Prof. Adrian Gerlich at the University of Waterloo to perform the required research and identify a processing window facilitating electronic packaging using silver nanopaste. Upon completion of this project Microbonds will utilize the results and knowledge gained in exploring new packaging technology and evaluate the possibility of pursuing further joining and characterization research activities with Prof. Gerlich.