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Soft, stretchable, multi-layer printed circuit board technology

Soft, stretchable, multi-layer printed circuit board technology
柔软、可拉伸、多层印刷电路板技术
批准号：
520631-2017
负责人：
Madden, John
金额：
$1.09万
依托单位：
University of British Columbia
依托单位国家：
加拿大
项目类别：
Idea to Innovation
财政年份：
2017
资助国家：
加拿大
项目状态：
已结题
起止时间：
2017-01-01 至 2018-12-31
来源：
https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=618674
关键词：
Softstretchablemultilayerprinted

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英文摘要
Flexible and stretchable electronics are desired so that sensing, computation and communication can be seemlessly integrated into clothing, onto the skin or even within the body. A major challenge has been the creation of printed circuit boards that are truly compliant. Recent published work has gone well beyond polyimide flex pcb technology, but depends on relatively high cost processes. In this market assessment we propose to explore the prospects for and impact of commercialization of a technology that uses low cost materials and existing fabrication tools to create flexible and stretchable printed circuit boards.
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  • 批准号：
    RGPIN-2018-06888
  • 项目类别：
    Discovery Grants Program - Individual
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