Smart Conductive Bio-based Polymeric Composites and Their Foams
Smart Conductive Bio-based Polymeric Composites and Their Foams
批准号:
261661-2013
负责人:
Naguib, Hani
金额:
$2.11万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2017
资助国家:
加拿大
项目状态:
已结题
起止时间:
2017-01-01 至 2018-12-31
中文摘要
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英文摘要
Materials and composites for thermal and electrical management are increasingly important for electronic packaging because the excessive heat generated in electronic components limits the reliability, performance, and miniaturization of these electronics. In the applications which require higher thermal conductivity, such as in electronic packaging and encapsulations, satellite devices, electric cable insulation, Light Emitting Diodes LEDs, and photovoltaics solar cells, multifunctional polymer composites are becoming more commonly used. The proposed research, entitled "Smart Conductive Biobased Polymeric Composites and Their Foams," aims to bridge fundamental science to technology by investigating the processing-structure-property relationships of multifunctional biocomposites and their foams. The overall goal of this research is to design and develop light weight smart "green" composites and their foams that possess tailored multifunctional properties (i.e., electrical, thermal, and mechanical properties). In this context, the short-term objectives of this research are i) designing novel manufacturing technologies to fabricate micro-and-nano-structures of biocomposites and foams; (ii) Characterizing of the micro and nanoscopic properties and multifunctional properties of these biocomposites and their foams; (iii) Modeling and optimizing the structure-to-property relationships of the biocomposites and their foams. Successful completion of this research will represent a major contribution to the area of advanced materials and manufacturing for Canada and global manufacturing sector. In particular, this research will offer new insights to fabricate new class of green and bio-based composites with energy saving properties that can be used in lightweight electronic enclosures with tailored cooling, electrical insulating, and electromagnetic radiation shielding performances.
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