Development of a protocol for high-resolution Auger and Transmission Electron Microscopy / Spectroscopy analysis on advanced III-V semiconductor devices

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Advanced photonic devices are at the basis of optical telecommunication networks and data centres. Thesedevices are built from complex materials structures, involving several fabrication steps and operate in harshconditions. Knowledge of the structure of these materials is key for developing new devices and understandingthe evolution and degradation of devices during fabrication and operation. In this project we investigatecomponents of photonics integrated circuits using advanced structural and chemical characterization techniqueswith high spatial resolution. We will develop advanced transmission electron microscopy, electron energy lossspectroscopy, and surface analysis methods to characterize, at different lengthscales -from nanometers to theatomic level- the composition and structure of photonic devices. Using these methodologies, we will provide tothe industrial partner, ArtIC Photonics, understanding of the photonic integrated circuits they produce, theevolution of nanoscale components of these devices during fabrication, and the degradation of these devicesduring operating conditions.