Highly integrated Radio-Frequency Front-End for next generation wireless systems
适用于下一代无线系统的高度集成射频前端
基本信息
- 批准号:RGPIN-2017-04342
- 负责人:
- 金额:$ 1.75万
- 依托单位:
- 依托单位国家:加拿大
- 项目类别:Discovery Grants Program - Individual
- 财政年份:2019
- 资助国家:加拿大
- 起止时间:2019-01-01 至 2020-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Mobile traffic has been doubling annually, and this exponential growth is set to continue over the next five years. By the end of the decade, the average mobile user could be downloading one terabyte of data each year. To meet this demand, a fifth-generation (5G) cellular technology will need to be developed. The integration of the radio-frequency (RF) front-end, however, presents several challenges that still need to be addressed for the advent of the next generation of wireless communication systems. Current solutions are too expensive and power hungry for portable systems. Also, due to interconnect losses and crosstalk, the integration of passive millimeter-wave components with active integrated circuits is a complex process.***The global objective of this research program is to explore enabling technologies for the low-cost fabrication of high performance, fully integrated millimeter-wave passive RF front-end. The long-term objectives are: a) advance knowledge in the field of millimeter-wave systems, b) apply this knowledge to propose innovative and efficient technologies for ultra-high data-rate systems and c) train HQP in the field of RF system design. More specifically, in the next 5 years, this program will focus on exploring novel solutions for 5G and beyond integrated front-ends for wireless networks. To achieve this goal I will pursue four core research threads: 1) explore novel scanning antennas to efficiently maximize channel capacity; 2) study multi-functionality integration techniques in order to reduce the size of the passive front-end sub-systems while preserving their performances; 3) research system on a package (SoP) technologies for the complete integration of all components and 4) investigate power dissipation techniques for highly integrated millimeter-wave transceivers.***Wireless communications are omnipresent and mobile users are continually asking for larger data-rate. This exciting undertaking will explore several innovative ideas targeting the next generation of wireless networks, such as highly integrated frequency scanning beamforming network and multifunction components, which will be integrated on into single platform. The potential impact of the proposed program is vast: the investigation of novel technologies for millimeter-wave wireless systems could fundamentally change the way users interact with their communication devices. This research program will help develop an expertise in this emerging field with promising economic benefits that are widespread in scope. It will also provide unique training for graduate and undergraduate students by exposing them to design, fabrication and integration of millimetre-wave systems. Such skills are currently highly sought after by the large pools of Canadian companies working in the field of RF devices.
移动的流量每年翻一番,这种指数增长将在未来五年继续下去。到2020年,平均每个移动的用户每年可以下载1 TB的数据。为了满足这一需求,将需要开发第五代(5G)蜂窝技术。然而,射频(RF)前端的集成提出了几个挑战,仍然需要解决的下一代无线通信系统的出现。当前的解决方案对于便携式系统来说太昂贵且耗电。此外,由于互连损耗和串扰,无源毫米波元件与有源集成电路的集成是一个复杂的过程。该研究计划的全球目标是探索低成本制造高性能,完全集成的毫米波无源RF前端的技术。长期目标是:a)毫米波系统领域的先进知识,B)应用这些知识为超高数据速率系统提出创新和有效的技术,以及c)在RF系统设计领域培训HQP。更具体地说,在未来5年内,该计划将专注于探索5G及无线网络集成前端的新解决方案。为了实现这一目标,我将追求四个核心的研究思路:1)探索新的扫描天线,以有效地最大化信道容量; 2)研究多功能集成技术,以减少无源前端子系统的大小,同时保持其性能; 3)研究系统级封装(SoP)技术,以实现所有组件的完全集成;研究高度集成毫米波收发器的功耗技术。*无线通信无所不在,移动的用户不断要求更大的数据速率。这项令人兴奋的工作将探索针对下一代无线网络的几个创新想法,例如高度集成的频率扫描波束成形网络和多功能组件,这些组件将集成到单一平台上。拟议计划的潜在影响是巨大的:对毫米波无线系统新技术的研究可能从根本上改变用户与其通信设备的交互方式。这项研究计划将有助于发展这一新兴领域的专业知识,具有广泛的经济效益。它还将为研究生和本科生提供独特的培训,让他们接触毫米波系统的设计、制造和集成。这些技能目前受到在RF设备领域工作的大量加拿大公司的高度追捧。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Deslandes, Dominic其他文献
Electromechanical Tuning of Piecewise Stiffness and Damping for Long-Range and High-Precision Piezoelectric Ultrasonic Transducers
- DOI:
10.1109/jmems.2020.3005917 - 发表时间:
2020-10-01 - 期刊:
- 影响因子:2.7
- 作者:
Robichaud, Alexandre;Deslandes, Dominic;Nabki, Frederic - 通讯作者:
Nabki, Frederic
Parallel plate waveguide with anisotropic graphene plates: Effect of electric and magnetic biases
- DOI:
10.1063/1.4794169 - 发表时间:
2013-03-21 - 期刊:
- 影响因子:3.2
- 作者:
Malekabadi, Ali;Charlebois, Serge A.;Deslandes, Dominic - 通讯作者:
Deslandes, Dominic
Backward to Forward Scanning Periodic Leaky-Wave Antenna With Wide Scanning Range
- DOI:
10.1109/tap.2017.2705021 - 发表时间:
2017-07-01 - 期刊:
- 影响因子:5.7
- 作者:
Rahmani, Mohammad H.;Deslandes, Dominic - 通讯作者:
Deslandes, Dominic
Accurate modeling, wave mechanisms, and design considerations of a substrate integrated waveguide
- DOI:
10.1109/tmtt.2006.875807 - 发表时间:
2006-06-01 - 期刊:
- 影响因子:4.3
- 作者:
Deslandes, Dominic;Wu, Ke - 通讯作者:
Wu, Ke
A Novel Topology for Process Variation-Tolerant Piezoelectric Micromachined Ultrasonic Transducers
- DOI:
10.1109/jmems.2018.2876384 - 发表时间:
2018-12-01 - 期刊:
- 影响因子:2.7
- 作者:
Robichaud, Alexandre;Deslandes, Dominic;Nabki, Frederic - 通讯作者:
Nabki, Frederic
Deslandes, Dominic的其他文献
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{{ truncateString('Deslandes, Dominic', 18)}}的其他基金
Highly integrated Radio-Frequency Front-End for next generation wireless systems
适用于下一代无线系统的高度集成射频前端
- 批准号:
RGPIN-2017-04342 - 财政年份:2022
- 资助金额:
$ 1.75万 - 项目类别:
Discovery Grants Program - Individual
Highly integrated Radio-Frequency Front-End for next generation wireless systems
适用于下一代无线系统的高度集成射频前端
- 批准号:
RGPIN-2017-04342 - 财政年份:2021
- 资助金额:
$ 1.75万 - 项目类别:
Discovery Grants Program - Individual
Highly integrated Radio-Frequency Front-End for next generation wireless systems
适用于下一代无线系统的高度集成射频前端
- 批准号:
RGPIN-2017-04342 - 财政年份:2020
- 资助金额:
$ 1.75万 - 项目类别:
Discovery Grants Program - Individual
Highly integrated Radio-Frequency Front-End for next generation wireless systems
适用于下一代无线系统的高度集成射频前端
- 批准号:
RGPIN-2017-04342 - 财政年份:2018
- 资助金额:
$ 1.75万 - 项目类别:
Discovery Grants Program - Individual
Highly integrated Radio-Frequency Front-End for next generation wireless systems
适用于下一代无线系统的高度集成射频前端
- 批准号:
RGPIN-2017-04342 - 财政年份:2017
- 资助金额:
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- 资助金额:
$ 1.75万 - 项目类别:
Discovery Grants Program - Individual
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微系统和毫米级三维集成
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