Design for electromigration: modeling for reliable metallization and optimal operation

电迁移设计:可靠金属化和最佳运行建模

基本信息

  • 批准号:
    517021-2018
  • 负责人:
  • 金额:
    $ 1.53万
  • 依托单位:
  • 依托单位国家:
    加拿大
  • 项目类别:
    Postgraduate Scholarships - Doctoral
  • 财政年份:
    2019
  • 资助国家:
    加拿大
  • 起止时间:
    2019-01-01 至 2020-12-31
  • 项目状态:
    已结题

项目摘要

electromigration, multiscale model, reliability, time to failure, interconnects, integrated circuits (ICs), physical design and layout, printed circuit boards (PCBs), thermomigration, microelectronics
电迁移、多尺度模型、可靠性、故障时间、互连、集成电路(IC)、物理设计和布局、印刷电路板(PCB)、热迁移、微电子学

项目成果

期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)

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Joshi, Surabhi其他文献

Comparative Evaluation of the Remineralizing Potential of Commercially Available Agents on Artificially Demineralized Human Enamel: An In vitro Study
  • DOI:
    10.4103/ccd.ccd_679_18
  • 发表时间:
    2019-10-01
  • 期刊:
  • 影响因子:
    1.2
  • 作者:
    Joshi, Chintan;Gohil, Uma;Joshi, Surabhi
  • 通讯作者:
    Joshi, Surabhi
Biphasic Calcium Phosphate Versus Demineralized Freeze-Dried Bone Allograft in the Treatment of Periodontal Disease: A Clinical and Radiographical Evaluation.
  • DOI:
    10.7759/cureus.29131
  • 发表时间:
    2022-09
  • 期刊:
  • 影响因子:
    1.2
  • 作者:
    Kumar, Santosh;Desai, Nahid;Joshi, Surabhi;Hirani, Tanvi;Gajjar, Shreya;Patel, Chandni;Bhakkand, Sushmita R.;Girdhar, Gaurav A.;Govindool, Sharaschandra R.;Fakuradzi, Wan Farizatul Shima Wan Ahmad;Haque, Mainul
  • 通讯作者:
    Haque, Mainul
Identifying Gingival Pigmentation Patterns and Skin Color and Its Co-relation With Serum Ferritin Levels in Thalassemic Patients.
  • DOI:
    10.7759/cureus.28015
  • 发表时间:
    2022-08
  • 期刊:
  • 影响因子:
    1.2
  • 作者:
    Gajjar, Shreya;Kaur, Harjot;Girdhar, Gaurav;Kaur, Ashish;Patel, Chandni;Mehta, Rupal;Bhakkand, Sushmita;Hirani, Tanvi;Joshi, Surabhi;Irfan, Mohammed;Fakuradzi, Wan Farizatul Shima Binti Wan Ahmad;Sinha, Susmita;Haque, Mainul;Kumar, Santosh
  • 通讯作者:
    Kumar, Santosh

Joshi, Surabhi的其他文献

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{{ truncateString('Joshi, Surabhi', 18)}}的其他基金

Design for electromigration: modeling for reliable metallization and optimal operation
电迁移设计:可靠金属化和最佳运行建模
  • 批准号:
    517021-2018
  • 财政年份:
    2020
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Postgraduate Scholarships - Doctoral
Design for electromigration: modeling for reliable metallization and optimal operation
电迁移设计:可靠金属化和最佳运行建模
  • 批准号:
    517021-2018
  • 财政年份:
    2018
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Postgraduate Scholarships - Doctoral

相似海外基金

Effect of electromigration on corrosion and mass transfer in high-temperature liquid metals
电迁移对高温液态金属腐蚀和传质的影响
  • 批准号:
    23K17676
  • 财政年份:
    2023
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Grant-in-Aid for Challenging Research (Exploratory)
Innovation of electromigration-driven fine-injection method for nanowire scaling up
用于纳米线放大的电迁移驱动精细注射方法的创新
  • 批准号:
    23H01300
  • 财政年份:
    2023
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
SHF:Small: Learning-based Fast Analysis and Fixing for Electromigration Damage
SHF:Small:基于学习的电迁移损伤快速分析和修复
  • 批准号:
    2305437
  • 财政年份:
    2023
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Standard Grant
The mechanism of electromigration studied by real-time ultrasound monitoring for single nanowire
单根纳米线实时超声监测研究电迁移机理
  • 批准号:
    22H01908
  • 财政年份:
    2022
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Electromigration for high-temperature interface control
用于高温界面控制的电迁移
  • 批准号:
    21K18807
  • 财政年份:
    2021
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Grant-in-Aid for Challenging Research (Exploratory)
SHF:Small: Machine Learning Approach for Fast Electromigration Analysis and Full-Chip Assessment
SHF:Small:用于快速电迁移分析和全芯片评估的机器学习方法
  • 批准号:
    2007135
  • 财政年份:
    2020
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Standard Grant
Design for electromigration: modeling for reliable metallization and optimal operation
电迁移设计:可靠金属化和最佳运行建模
  • 批准号:
    517021-2018
  • 财政年份:
    2020
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Postgraduate Scholarships - Doctoral
Custom Tool to Produce and Test Micro Dog-bone Solder Specimen for Electromigration
用于生产和测试电迁移微型狗骨焊料样本的定制工具
  • 批准号:
    539570-2019
  • 财政年份:
    2019
  • 资助金额:
    $ 1.53万
  • 项目类别:
    University Undergraduate Student Research Awards
Design for electromigration: modeling for reliable metallization and optimal operation
电迁移设计:可靠金属化和最佳运行建模
  • 批准号:
    517021-2018
  • 财政年份:
    2018
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Postgraduate Scholarships - Doctoral
Understanding the Effect of Ordered Twinning on Electromigration Failure in Advanced Metallic Interconnects
了解有序孪晶对先进金属互连中电迁移失效的影响
  • 批准号:
    1807686
  • 财政年份:
    2018
  • 资助金额:
    $ 1.53万
  • 项目类别:
    Standard Grant
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