Power Electronics for the Next Generation of Electrified Vehicles

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Electrified vehicles (EVs), including battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell electric vehicles (FCEVs), are a key measure to reduce emissions and mitigate climate change. EVs utilize a range of power electronics (PE) systems - including converters, such as auxiliary power modules (APM), onboard chargers (OBC), and motor drives (MD) - which are critical elements of the overall powertrain. Increases in power conversion efficiency and power density are needed to improve range, performance, and cost-effectiveness of the next generation of EVs. Power semiconductor devices using state-of-the-art materials, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) - also known as wide band gap (WBG) devices - allow a higher switching frequency when compared with Silicon (Si) based devices that are still widely used, and are viewed as key enabling technologies to realize these much-needed improvements. The objective of the proposed research program is to support the next generation of EVs by designing power converters that are more cost effective, efficient, and reliable than the current state-of-the-art. To accomplish this, we will develop models, algorithms, and tools that allow the design and optimization of advanced and integrated power modules utilizing WBG devices, will apply the outcomes into novel PE topologies, circuit integration methods, and a prototype integrated power module. However, as WBG devices operate at higher temperatures, PE systems, components, and modules that utilize them need to be designed to address thermal management (TM) issues. The high switching speed of WBG devices also creates challenges with gate drives and electromagnetic interference (EMI). The proposed research program will consider a range of approaches that could inform the development of novel PE topologies, components, and modules that exploit WBG devices, including: optimal circuit topologies; power stage integration and sharing; control architectures and techniques; gate driver integration; integrated TM strategies within the power module to remove layers of thermal interface material; and high power-density packaging technologies (encompassing novel materials and additive manufacturing techniques). In addition to specific power, increases in efficiency at the component and system levels will be addressed over the duration of the project. The proposed research will enable the development of new PE components and systems with increased power density and efficiency and accelerate the development of the next generation of higher-performance, lower-cost electrified vehicles. It will also advance the state-of-the-art in the scientific literature and help meet the growing demand from Canada's engineering sector for HQP with hands-on experience and an understanding of power electronics, contributing to job creation and growth in the region.