3D-Printed Electromagnetic Structures for Antenna and Millimeter-Wave Engineering Applications
用于天线和毫米波工程应用的 3D 打印电磁结构
基本信息
- 批准号:RGPIN-2022-05204
- 负责人:
- 金额:$ 3.35万
- 依托单位:
- 依托单位国家:加拿大
- 项目类别:Discovery Grants Program - Individual
- 财政年份:2022
- 资助国家:加拿大
- 起止时间:2022-01-01 至 2023-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
3D printing is a powerful technique to build objects with complex geometries that are difficult, costly and sometimes not even possible to manufacture with conventional machining methods. Yet, it is comparatively recently that 3D printing technology has started to be explored for antennas and high-frequency electromagnetic (EM) structures-a field in which precision machining of bulk metal and dielectric materials using computer numerically controlled (CNC) drills and lathes remains widespread. In this research program we will investigate 3D-printed EM dielectric structures with advanced functionalities and reconfigurability using dielectric fluids. The outcomes of this research program are aimed at users of high-performance front-end wireless equipment for whom system reconfigurability and weight reduction can provide a decisive competitive advantage. This applies to manufacturers of communications and radar hardware for civilian and defence aircraft, satellites and maritime vessels all of which carry multiple antenna systems on-board. The frequency bands that we will use for prototype design are 8-12 GHz (X band) and 18-40 GHz (K and Ka bands), which cover point-to-point gigabit wireless links (i.e. tower to tower), broadband satellite communications, remote sensing and aeronautical/maritime radionavigation. The 3D printing methods we will use are fused deposition modeling (FDM) and stereolithography (SLA). For the fluidic aspects of this research, a 20-channel fluidic pumping system from Darwin Microfluidics Corp. (Paris, France) to source fluid in and out of the structures. All test and measurement of the EM structures will take place at Queen's University's laboratory facilities. Over the course of this program, highly qualified personnel trainees will learn advanced lab skills that include: antenna radiation pattern measurements, antenna efficiency measurements, design of antenna test mounts, 3D printing methods, antenna construction, PCB manufacturing and design of microfluidic systems. Each subject area described in this proposal reflects technologies that are used in industry today and they will serve to demonstrate that 3D printed dielectric structures can deliver excellent performance on par with what exists at present but at a fraction of the cost and time needed to fabricate them.
3D打印是一种强大的技术,可以构建具有复杂几何形状的物体,这些物体困难,昂贵,有时甚至不可能用传统的加工方法制造。然而,相对而言,3D打印技术已经开始用于天线和高频电磁(EM)结构的探索-在该领域中,使用计算机数控(CNC)钻头和车床对大块金属和介电材料进行精密加工仍然很普遍。在这项研究计划中,我们将研究具有先进功能和可重构性的3D打印EM电介质结构。这项研究计划的成果是针对用户的高性能前端无线设备,为他们的系统可重构性和重量减轻可以提供一个决定性的竞争优势。这适用于民用和国防飞机、卫星和海上船只的通信和雷达硬件制造商,所有这些飞机都带有多天线系统。我们将用于原型设计的频带为8-12吉赫(X波段)和18-40吉赫(K和Ka波段),涵盖点对点千兆位无线链路(即塔到塔)、宽带卫星通信、遥感和航空/海上无线电导航。我们将使用的3D打印方法是熔融沉积成型(FDM)和立体光刻(SLA)。对于本研究的流体方面,使用来自达尔文微流体公司(巴黎,法国)的20通道流体泵送系统,以使流体流入和流出结构。EM结构的所有测试和测量将在皇后大学的实验室设施中进行。在该计划的过程中,高素质的人员学员将学习先进的实验室技能,包括:天线辐射模式测量,天线效率测量,天线测试支架设计,3D打印方法,天线构造,PCB制造和微流体系统设计。本提案中描述的每个主题领域都反映了当今工业中使用的技术,它们将用于证明3D打印介电结构可以提供与目前存在的技术相当的优异性能,但制造它们所需的成本和时间却只有一小部分。
项目成果
期刊论文数量(0)
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Saavedra, Carlos其他文献
Hybrid photonic entanglement: Realization, characterization, and applications
- DOI:
10.1103/physreva.80.042322 - 发表时间:
2009-10-01 - 期刊:
- 影响因子:2.9
- 作者:
Neves, Leonardo;Lima, Gustavo;Saavedra, Carlos - 通讯作者:
Saavedra, Carlos
Superresolution imaging in optical tweezers using high-speed cameras
- DOI:
10.1364/oe.18.003322 - 发表时间:
2010-02-15 - 期刊:
- 影响因子:3.8
- 作者:
Pablo Staforelli, Juan;Vera, Esteban;Saavedra, Carlos - 通讯作者:
Saavedra, Carlos
Infrared light field imaging system free of fixed-pattern noise
- DOI:
10.1038/s41598-017-13595-7 - 发表时间:
2017-10-12 - 期刊:
- 影响因子:4.6
- 作者:
Coelho, Pablo A.;Tapia, Jorge E.;Saavedra, Carlos - 通讯作者:
Saavedra, Carlos
A Wideband Low-Noise Variable-Gain Amplifier With a 3.4 dB NF and up to 45 dB Gain Tuning Range in 130-nm CMOS
- DOI:
10.1109/tcsii.2018.2878742 - 发表时间:
2019-07-01 - 期刊:
- 影响因子:4.4
- 作者:
Baumgratz, Filipe Dias;Saavedra, Carlos;Bampi, Sergio - 通讯作者:
Bampi, Sergio
Phylogeographic analysis of introns and mitochondrial DNA in the clam Ruditapes decussatus uncovers the effects of Pleistocene glaciations and endogenous barriers to gene flow
- DOI:
10.1016/j.ympev.2013.11.003 - 发表时间:
2014-02-01 - 期刊:
- 影响因子:4.1
- 作者:
Cordero, David;Pena, Juan B.;Saavedra, Carlos - 通讯作者:
Saavedra, Carlos
Saavedra, Carlos的其他文献
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{{ truncateString('Saavedra, Carlos', 18)}}的其他基金
Millimeterwave Integrated Circuits and Arrays for 5G Wireless Front-Ends
用于 5G 无线前端的毫米波集成电路和阵列
- 批准号:
RGPIN-2016-04784 - 财政年份:2021
- 资助金额:
$ 3.35万 - 项目类别:
Discovery Grants Program - Individual
Broadband Gallium Nitride Power Amplifier for Microwave Calibration Instrumentation
用于微波校准仪器的宽带氮化镓功率放大器
- 批准号:
549245-2019 - 财政年份:2021
- 资助金额:
$ 3.35万 - 项目类别:
Alliance Grants
Millimeterwave Integrated Circuits and Arrays for 5G Wireless Front-Ends
用于 5G 无线前端的毫米波集成电路和阵列
- 批准号:
RGPIN-2016-04784 - 财政年份:2020
- 资助金额:
$ 3.35万 - 项目类别:
Discovery Grants Program - Individual
Broadband Gallium Nitride Power Amplifier for Microwave Calibration Instrumentation
用于微波校准仪器的宽带氮化镓功率放大器
- 批准号:
549245-2019 - 财政年份:2020
- 资助金额:
$ 3.35万 - 项目类别:
Alliance Grants
Millimeterwave Integrated Circuits and Arrays for 5G Wireless Front-Ends
用于 5G 无线前端的毫米波集成电路和阵列
- 批准号:
RGPIN-2016-04784 - 财政年份:2019
- 资助金额:
$ 3.35万 - 项目类别:
Discovery Grants Program - Individual
Millimeterwave Integrated Circuits and Arrays for 5G Wireless Front-Ends
用于 5G 无线前端的毫米波集成电路和阵列
- 批准号:
RGPIN-2016-04784 - 财政年份:2018
- 资助金额:
$ 3.35万 - 项目类别:
Discovery Grants Program - Individual
Millimeterwave Integrated Circuits and Arrays for 5G Wireless Front-Ends
用于 5G 无线前端的毫米波集成电路和阵列
- 批准号:
RGPIN-2016-04784 - 财政年份:2017
- 资助金额:
$ 3.35万 - 项目类别:
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Very-High current gallium nitride transconductance amplifiers
极高电流氮化镓跨导放大器
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500718-2016 - 财政年份:2017
- 资助金额:
$ 3.35万 - 项目类别:
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Current-Control Methods in Graphene Transmission Lines for Tunable Antennas on Printed Circuit Boards
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- 批准号:
521166-2017 - 财政年份:2017
- 资助金额:
$ 3.35万 - 项目类别:
Engage Grants Program
Millimeterwave Integrated Circuits and Arrays for 5G Wireless Front-Ends
用于 5G 无线前端的毫米波集成电路和阵列
- 批准号:
RGPIN-2016-04784 - 财政年份:2016
- 资助金额:
$ 3.35万 - 项目类别:
Discovery Grants Program - Individual
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