Mechanical reliability and strain engineering of semiconducting 2D materials

半导体二维材料的机械可靠性和应变工程

• 批准号: 577601-2022
• 负责人: Filleter, TobinWTW
• 金额: $ 3.28万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=759564
• 关键词: Mechanical; reliability; strain; engineering; semiconducting

Semiconducting two-dimensional (2D) materials are at the forefront of next-generation electronic materials development for applications in quantum transistors, flexible electronics, optoelectronics, and energy storage. These 2D materials offer atomic scale thicknesses allowing greater transistor density and extreme flexibility. However, while the mechanical properties of these 2D materials in their pristine forms are exceptional, the wide existence of defect of various types, densities, and configurations drastically reduces the mechanical properties in an elusive way. A quantitative characterization of the atomic structure-mechanical property relation of 2D materials can provide quantitative design guidelines for the stress-tolerant devices with a high-level confidence and thus is critical to the success of the device applications.This project is centered on the atomic structure and mechanical characterization, and the development of standards and best practices for the implementation of semiconducting 2D materials into electronic device design. A successful conclusion to this project will enable our industry partner Hitachi to translate the findings created by the project into standard characterization protocols, quantitative stress design requirements of 2D materials that will be central to next-generation device manufacturing systems. Not only will this enable the future of 2D material electronic device manufacturing in Canada, but this will position Hitachi as the world leader in enabling this design requirement and supplying of test systems for production facilities. Additionally, training of engineering students in the testing and operating of these fundamental technologies will enable knowledge translation that is crucial to developing Canadian expertise in 2D material device design.

半导体二维（2D）材料处于下一代电子材料开发的最前沿，用于量子晶体管，柔性电子，光电子和能量存储。这些2D材料提供原子级厚度，允许更大的晶体管密度和极高的灵活性。然而，虽然这些2D材料在其原始形式下的机械性能是例外的，但各种类型、密度和配置的缺陷的广泛存在以难以捉摸的方式急剧降低了机械性能。二维材料的原子结构-力学性能关系的定量表征可以为高置信度的应力容限器件的定量设计提供指导，因此对器件应用的成功至关重要。本项目围绕原子结构和力学表征，以及制定将半导体2D材料应用于电子设备设计的标准和最佳实践。该项目的成功完成将使我们的行业合作伙伴日立能够将该项目的研究结果转化为标准表征协议，2D材料的定量应力设计要求，这将成为下一代器件制造系统的核心。这不仅将使加拿大的2D材料电子器件制造业成为未来，而且将使日立成为满足这一设计要求和为生产设施提供测试系统的世界领导者。此外，对工程专业学生进行这些基础技术的测试和操作培训，将使知识转化成为可能，这对发展加拿大在2D材料设备设计方面的专业知识至关重要。