Assembly and adhesion mechanics of 2D materials for scalable production of next-generation electronics

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Research Background The demand for faster, smaller, more flexible, and more sensitive electronics has triggered the revolution of electronics manufacturing in recent years, as silicon-based innovations have almost reached its physical limitations. Viable alternatives for silicon to make next-generation electronics that provide unprecedented performance are highly sought-after to support a variety of transformational technologies (i.e., autonomous vehicles, augmented reality, and the internet of things). While the industry is experimenting with many materials, the class of two-dimensional materials (2DM) is one of the most promising building blocks for next-generation electronics due to their superior physical properties. Business studies by McKinsey & Company projected a $70 billion market size for 2DM electronics in 2030. However, the scalable production of 2DM-based electronics has been significantly hampered due to the lack of high-throughput and residue-free assembly technologies. The atomically thin structures need to be transferred from their growth substrates to targeted places for electronics assembly in a scalable and efficient manner, which requires advanced manipulation at nanoscale. Innovative approaches for high-throughput assembly of 2DM as easy as manipulating Lego blocks are demanded to transfer the lab-scale 2DM-based inventions to the marketplace. Research Program The long-term objective of the proposed Research Program will aim to transfer 2DM-based electronics to the marketplace by enabling their high-throughput productions. Toward this goal, the research program will be divided into three short-term objectives: 1) develop a comprehensive understanding of the adhesion mechanics at 2DM interfaces; 2) apply the knowledge in 1) to develop a novel platform to enable high-throughput and residue-free transfer printing of 2DM; 3) apply the transfer printing platform developed in 2) to assemble ultrathin electronics in scale. This will formulate a closed-loop research program integrating fundamental understandings into the design and fabrication of novel assembly technologies for scalable manufacturing of next-generation electronics. Impact The proposed research program will impact the production of next-generation ultrathin film-based electronics and provide a comprehensive understanding of the adhesion mechanics of ultrathin films. The prospective high throughput assembly technologies will lead to unprecedented advancements in the applications of low-dimensional materials, which will benefit Canadian companies in industries including electronics, automobiles, telecommunications, and supercomputing. At least 15 highly qualified personnel will be trained within an interdisciplinary, collaborative, diverse, and supportive environment where they will gain marketable knowledge and skills in mechanical engineering, materials science, and nanotechnology and develop a broad and deep sphere of vision for their future.