Compact Spray Cooling Module for Viable High-heat-flux Thermal Management

紧凑型喷雾冷却模块，实现可行的高热通量热管理

• 批准号: RGPIN-2018-04275
• 负责人: Li, Ri
• 金额: $ 5.68万
• 依托单位: University of British Columbia
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=761766
• 关键词: Compact; Spray; Cooling; Module; Viable

The rapid technological advancements in microelectronics and power electronics have been accompanied by continuous miniaturization and power increase of electronic components. Large amounts of heat need to transfer through small areas, while temperature rises must be below safety limits that are dictated by material and reliability constraints. To handle the high heat fluxes, there is an urgent need for aggressive and innovative liquid cooling techniques. Despite its highest cooling effectiveness demonstrated by numerous research studies, spray cooling has long been facing significant gap from being a viable cooling technique. This research will close the longstanding research-application gap by developing a Compact Spray Cooling Module (CSCM), which has internal spray impingement and can be directly mounted for cooling. CSCM has a novel spray generator that generates predictable, controllable and effective spray flow. CSCM can cool electronic components using water or other non-dielectric coolants. This will be achieved by developing an electrically-insulating, thermally-conductive, and surface-enhanced wall using Aluminum Nitride plate and copper micro-particles. CSCM has efficient fluid management so that vapor and liquid are constantly removed to sustain effective free-surface flows inside CSCM. CSCM is different from all previous spray cooling setups in terms of spray, surface, and fluid management. Fundamental understanding of its unique fluid dynamics and heat transfer is crucial to the development of CSCM. In the Thermal Management & Multiphase Flows Lab at UBC Okanagan, extensive experimental studies combined with theoretical analyses and numerical simulations will be conducted to investigate the hydrodynamics of spray flow, the fluid mechanics and heat transfer of spray impact boiling on microporous surfaces, and the flow dynamics of vapor and liquid in fluid management. The research will provide important contribution to the community of thermal fluid sciences. CSCM will make spray cooling viable for computers, data centers, power converters, hybrid/electric vehicles, satellites, spacecraft, aircraft, directed energy weapons, radars, etc. With superior cooling capacity, CSCM will speed up or enable next-generation products and technologies in many high-tech industries in Canada such as microelectronics, power electronics, aviation, and defense. The trained HQP will become highly qualified engineers of liquid cooling and thermal management.

微电子和电力电子技术的快速发展伴随着电子元件的不断小型化和功率增加。大量的热量需要通过小区域传递，而温升必须低于由材料和可靠性限制决定的安全限值。为了处理高的热通量，迫切需要积极和创新的液体冷却技术。尽管许多研究表明喷雾冷却具有最高的冷却效率，但长期以来一直面临着成为可行的冷却技术的巨大差距。本研究将通过开发具有内部喷雾冲击并可直接安装用于冷却的紧凑型喷雾冷却模块（CSCM）来缩小长期存在的研究与应用差距。 CSCM具有一种新型的喷雾发生器，可产生可预测、可控和有效的喷雾流。CSCM可以使用水或其他非介电冷却剂冷却电子元件。这将通过使用氮化铝板和铜微粒开发电绝缘、导热和表面增强的壁来实现。CSCM具有高效的流体管理，因此蒸汽和液体不断被移除以维持CSCM内部的有效自由表面流动。CSCM在喷雾、表面和流体管理方面不同于以前的所有喷雾冷却设置。对其独特的流体动力学和传热学的基本理解是CSCM发展的关键。在UBC Okanagan的热管理和多相流实验室，将进行广泛的实验研究，结合理论分析和数值模拟，以研究喷雾流的流体动力学，喷雾冲击沸腾在微孔表面上的流体力学和传热，以及流体管理中蒸汽和液体的流动动力学。 该研究将为热流体科学界做出重要贡献。CSCM将使喷雾冷却可行的计算机，数据中心，电源转换器，混合/电动汽车，卫星，航天器，飞机，定向能武器，雷达等具有上级冷却能力，CSCM将加快或使下一代产品和技术在加拿大许多高科技行业，如微电子，电力电子，航空和国防。经过培训的HQP将成为高素质的液体冷却和热管理工程师。