面向多尺度/跨尺度微型零件全自动微装配的微装配空间数字化技术基础及应用研究

微操作/微装配系统中的显微视觉系统存在高分辨率、小视场、小景深问题，导致实现多尺度和跨尺度微装配存在技术障碍，也制约了基于显微视觉伺服的全自动微装配的实现。针对这些问题，并以实现ICF微靶全自动快速微装配需求为驱动，本项目提出计算机显微视觉断层扫描技术（Computed microscopic visual tomography, CMVT）的概念和基于CMVT和微型零件CAD模型的微型零件重构方法的微装配空间数字化技术的概念。研究CMVT的原理及方法和微装配空间数字化的技术与方法。在实现微装配空间数字化的基础上，研究显微视场和景深的拓展方法，研究多尺度/跨尺度微型零件、微操作手和/或微操作机器人的位姿在线观测和精密检测方法，研究微装配路径规划方法和解耦控制方法，研究多尺度/跨尺度微型零件全自动微装配的方法。通过研究，为实现多尺度微型零件微装配的全自动化及开发相关仪器设备奠定基础。

The high resolution and the small field of view (FOV) and depth of field (DOF) of the microscopic visual systems in micromanipulation/microassembly systems result in the technical barriers to microassembling the multiscale and trans-scale micro parts, and restrict the realization of the full automatic microassembly based on the microscopic visual servoing control method. Aiming at these problems, and inspired by the requirements of microassembling the ICF micro-targets, in this project, we propose the concept of the computed microscopic visual tomography (CMVT) and the concept of digitizing the microassembly space based on the CMVT and the reconstruction method of the micro-parts based on its CAD model. Both the principle and method of the CMVT and the technology and method of digitizing the microassembly space will be thoroughly researched. Based on digitizing the micromanipulation/microassembly space, the expanding method of the FOV and FOV of the microscopic visual systems based on the digital information of the microassembly space, the in-line observing and precision measuring methods of the position and orientation of the multiscale/trans-scale micro parts, the end-effectors of the micromanipulators, and mictorobots for micromanipulation/microassembly, the path planning methods and the decoupling control methods of the microassembly, and the full automatic microassembly of the multiscale/trans-scale micro parts, will be thoroughly studied. Through this project, the theoretical fundamentals for realizing the full automatic micromanipulation/microassembly of the multiscale/trans-scale micro parts and developing corresponding instruments will be established.