目前在电子封装与MEMS器件封装中，微互连绝缘介质膜的成形主要有两种：一是基于PECVD法的SiO2绝缘膜，二是采用旋涂技术的有机绝缘膜。但面对几何形状更为复杂的高密度TSV-3D电子封装与MEMS器件加工集成，上述传统方法在保形性、厚度均匀性等方面已无法满足其要求。因此，面向未来复杂几何形状的3D电子封装和MEMS器件加工集成，研究开发一种具有超薄高保形绝缘层的精密成形方法显得极为重要。对此，本项目基于水溶液中电化学和化学接枝的基本原理，拟研究开发一种具有高保形、均匀可控，适合复杂几何形状微互连通道的有机绝缘层水相自组装成膜方法。该方法保形性将接近100%，且成本低廉。主要研究内容包括：1）以小孔径、大深宽比TSV封装为应用目标，研究适用于高阻硅片的有机绝缘膜水相化学接枝成膜新技术；2）以几何形状复杂的硅基MEMS器件加工集成为应用目标，研究低阻硅片的有机绝缘膜水相电化学接枝成膜新技术。

At present, in electronic packaging and MEMS device packaging, there are two methods to fabricate dielectric film of micro-interconnection. One is PECVD, which fabricate SiO2 dielectric film. The other is spin-coating, which fabricate organic dielectric film. however, for high density TSV 3D electronic packaging and MEMS device packaging with more complicated geometrical shape, these two methods are difficult to fabricate high step coverage and uniform thickness. therefore, it is important to develop a method to fabricate ultrathin and high conformal organic dielectric film. In this project, based on the basic theory of electrochemical and chemical grafting in water solution, a self-assembled method is exploited. This method can fabricate high conformal, uniform and controlled organic dielectric film, and it is suitable for micro-channel with complicated geometrical shape. The step coverage of organic dielectric film prepared by this method is approximated to 100%. In addition, this method has many other advanteges, such as low cost. The main research contents are: 1) aiming at applicating in TSV with small diameter and high aspect ratio, a chemical grafting technology in water solution is investegated at Si surface with higher electrical resisitivity; 2) aiming at applicating in MEMS device packaging with complicated geometrical shape, a electrochemical grafting method in water solution is investigated at Si surface with lower electrical resisitivity.