本项目拟通过研制光学显微电化学原位实验测试平台对硅薄膜电极结构在电化学环境中的充放电形态和微裂纹演化机理进行研究。通过将光学显微系统与电化学回路匹配，可实现对薄膜电极电化学过程进行原位测量。利用基于多频格栅变形载体的多尺度网格法对微区损伤，如微裂纹的形成、生长和扩展，以及薄膜电极结构的充放电形态，如三维形貌、曲率等演化过程进行在线定量表征。研究加载电压、充放电次数、薄膜初始残余应力、几何规格等多物理参量对薄膜电极结构充放电形态和微裂纹演化特征的影响规律，建立充放电形态和微裂纹演化的力学关联模型，揭示其损伤过程和失效机理。为设计新型硅薄膜电极、预测其使用寿命提供必要的研究。

The evolution of configurations and micro cracks of silicon thin film anode during its charge-discharge process is investigated in this project through the development of microscopic electrochemical in situ test platform. The electrochemical process of the silicon thin film anode can be measured in situ by matching the optical micro system with the electrochemical circuit. Based on the multiscale grid method utilizing the multi-frequency gratings, the appearance, the growth and the propagation of micro- damages such as micro cracks, as well as the evolution of thin film configurations such as the curvity are quantitatively characterized. The influences of external factors, such as load voltage, charge and discharge times and internal factors, such as the initial residual stress and geometric properties on the evolution of configurations and micro cracks of silicon thin film anode are also investigated. The multiscale mechanical evolution model is established to reveal the damage process and failure mechanism. The study in this project will provide a theoretical and experimental tool to design novel silicon thin film anode.