三维系统封装是提高器件集成度，超越摩尔定律的重要手段，而降低热压键合温度是三维系统封装技术发展的关键，本研究对微纳制造、三维封装、异质集成技术的发展具有积极推动作用。研究内容包括：1）理论分析纳米热压键合界面的原子扩散与受压变形行为，建立键合界面分子动力学（MD）模型，阐明纳米热压键合的内在机制；2）纳米多孔金属制备与性能测试，通过选择性腐蚀（脱合金化）及其改进技术制备出尺寸与性能可控的纳米多孔金属（Cu、Au），满足低温热压键合需求；3）基于纳米多孔金属的低温热压键合试验与应用研究，有效降低热压键合温度、压力和表面粗糙度要求。目前，三维系统封装对低成本、高性能（低应力、高可靠性）制造提出了新的要求，迫切需要发展新型低温键合技术。本项目实施为纳米封装与互连、低温键合技术研发开辟了新思路，对促进系统封装（SiP）、光电集成技术发展具有重要推动作用。

3D system packaging can increase device integration and slove the problem of "More than Moore", while decreasing thermocompression bonding temperature is the key technique for 3D system packaging. This research will greatly boost the development of micro/nano fabrication, 3D packaging and heterogeneous integration. It includes: 1) Analysis the atom diffusion behaviors at the interface of nano thermocompression bonding, building the nanobonding model based on molecular dynamics(MD) and illustration the mechanism of thermocompression bonding using nanoporous metal; 2) Prepration of size-controlable nanoporous metal (gold and copper) using selctive corrsion (dealloying) and testing their structure and performances; 3)Low temperature thermocpmpression bonding experiments and multi-layer stack bonding applications using nanoporous metal, which can decrease the requirements for bonding temperature, pressure and surface roughness. Nowadays, 3D system packaging poses a new requirement for low cost and high performances (low stress and high reliability) fabrication, it is necessary and urgent to develope novel low temperature bonding technology. This project will open a path for nanopackaging and low temperature bonding techniques, and it will boost the development of system in packaging (SiP) and optoelectronic integration.