无铅无镉钎焊材料是全球性的环保发展需求，高效低成本地制造环保钎焊材料薄片是微电子封装领域急需解决的瓶颈问题。本项目充分利用电磁成形和粉末冶金的组合优势，基于电磁压制方法制备微电子封装所需的环保钎料薄片，解决其成形加工难题；系统考查混合粉末成份、性能、粒度、压制及烧结工艺参数等对环保钎料致密度、均匀性、厚度、性能的影响，研究多种金属混合粉末颗粒高速压制时的相互作用及组织演化过程，揭示其成形、致密机理与规律；探讨成份、压制及烧结工艺对环保钎料组织、性能的综合作用机制，建立"工艺-组织-性能"、"成份-组织-性能"的关系，以钎焊性能为目标，寻求最优的环保钎料成份设计、压制及烧结工艺组合；优化工装及模具设计，探索环保钎料质量和性能的控制方法及工艺保障措施，为电磁压制制备微电子封装环保钎焊材料新技术的工程应用提供理论、数据和技术支持。

Adhesion material free of lead & cadmium is the global tendency required by environmental development. How to efficiently manufacture adhesion material free of lead & cadmium into chips at a low cost has been a bottleneck problem in microelectronics packaging field. To solve this problem, the electromagnetic compaction will be introduced to fabricate adhesion material chips so that the difficult forming problem can be avoided by combining the powder metallurgy technique and the electromagnetic forming technique. The effect of composition, performance and granularity of mixed powders, as well compaction parameters and sintering parameters on density, uniformity, thickness, performance of environmental friendly adhesion material will be systematically investigated. Interaction and microstructure evolution of various mixed metal powders during high-speed compaction process will be probed. Forming and densification mechanism and laws will be revealed. The comprehensive effects of composition, compaction parameters and sintering parameters on microstructure and performance of environmental friendly adhesion material will be studied. The relationship of "process-microstructure- performance" and "components-microstructure-performance" will be analyzed. The composition, compaction and sintering parameters will be synthetically optimized to obtain the best welding performance. The equipment and mould will be also optimized. The method and technical measure to control quality and performance of environmental friendly adhesion material will be worked out. As result, the project would provide theoretical and technological support for application of electromagnetic compaction to fabrication of environmental friendly adhesion material to be used in microelectronics packaging.